Innovacera Plating with Ni Aluminum Nitride / Beo / Alumina Dbc Ceramic Substrate

• Application: Electronic Devices, Power Supply, Semiconductors
• Conductive Layer: Thick Copper Layer
• Material: Al2O3
• Model NO.: INCA029
• Process: Direct Bonded Copper
• Color: White
• Thermal Shock Resistance: 250 T(C)
• Water Absorption: 0
• Thermal Conductivity: 16.7-24.8 W/M.K
• Processing Service: Moulding
• Density: 3.6-3.7g/cm3
• Compressive Strength: 2200-2300 MPa
• Volume Resistivity: >10^14
• Maximum Use Temperature: 1500-1600 C
• Flexural Strength: 345-358 MPa
• Vickers Hardness: 11-11.5 Gpa
• Material Composition: Alumina, Al2O3
• Speciality: High Insulation, High Strength
• Type: Ceramic Plate
• Transport Package: Carton Box with Foamwooden Box with Foam
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 200000 Piece/Pieces Per Month

Product Description

DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century.

 

DBC Substrate Features:

1.High mechanical strength,mechanically stable shape;high strength,fine thermal conductivity,excellent electrical
isolation;good adhesion,corrosion resistant;

2.Much better thermal cycling capabilities (up to 50000 cycles),high reliability;

3.May be structured just like PCB boards or IMS substrates to get etched wiring;

4.No contamination,environmentally clean;

5.Wide application temperature:-55 ~ 850; The thermal expansion coefficient is closed to that of silicon, so production technologies of power module are greatly simplified. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer's drawings or samples

 

Properties
 

Properties		Unit	Test Method	Material
				IN94	IN96	IN99
Mechanical	Color	-	-	White	White	Ivory
	Alumina Content	%	-	94	96	99
	Bulk Density	g/cm3	ASTM C-20-83	3.70	3.80	3.90
	Surface Roughness	Um	Profilometer	-	Max 0.6	-
	Water Absorption	%	ASTM C373-72	0.0	0.0	0.0
	Average Crystalline Size	Um	ASTM E112-88	4	3	4
	Flexural Strength (20°C)	MPa	ASTM F417-78	350	370	370
	Elastic Modulus	Gpa	ASTM C773-82	290	310	340
	Poisson's Ratio	-	ASTM C773-82	0.22	0.22	0.22
	Compressive Strength	Mpa	ASTM C773-82	2100	-	2500
	Hardness	-	Knoop 1KG	12	-	14
	Fracture Toughness	Mpa.m1/2	NOCHED BEAM	3.4	-	4.5
Thermal	Thermal Conductivity (20°C)	W/m.K	ASTM C408-82	21	24	28
	Coefficient of Thermal Expansion(20~1000°C)	×10-6/°C	ASTM C372-81	8.0	7.8	8.1
	Specific Heat	Cal/g°C	ASTM C351-82	0.2	0.2	0.2
	Thermal Shock Resistance	°C	Customer	200	200	200
	Max. Use Temperature	°C	-	1600	1600	1650
Electrical	Dielectric Strength	KV/mm	ASTM D116-76	≥12	≥15	≥17
	Dielectric Constance (1MHz.25°C)	-	ASTM D150-81	9.2	9.6	9.7
	Dielectric Loss (tan delta, 1MHz.25°C)	-	ASTM D150-81	0.0004	0.0003	0.0002
	Volume Resistivity (25°C)	Ωcm2/cm	ASTM D1829-68	≥10 14	≥10 14	≥10 14