Innovacera Plating with Ni Aluminum Nitride / Beo / Alumina Dbc Ceramic Substrate

• Application: Aerospace, Electronics, Medical, Refractory
• Conductive Layer: Thick Copper Layer
• Material: Al2O3
• Model NO.: INCA029
• Process: Direct Bonded Copper
• Thickness: Customized
• Vickers Hardness: 11
• Dielectric Loss: 9
• Shape: Plate
• Max Use Temperature: 1400°c
• Color: White
• Hardness: 11.5
• Thermal Conductivity: 24.7
• Processing Service: Moulding, Active Metal Bonding
• Density: 3.6-3.7
• Flexural Strength: 300MPa
• Material Composition: Alumina, Al2O3
• Speciality: High Insulation, High Strength
• Type: Ceramic Plates
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 200000 Piece/Pieces Per Month

Product Description

DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century.
 
DBC Substrate Features:
1.High mechanical strength,mechanically stable shape;high strength,fine thermal conductivity,excellent electrical
isolation;good adhesion,corrosion resistant;
2.Much better thermal cycling capabilities (up to 50000 cycles),high reliability;
3.May be structured just like PCB boards or IMS substrates to get etched wiring;
4.No contamination,environmentally clean;
5.Wide application temperature:-55 ~ 850; The thermal expansion coefficient is closed to that of silicon, so production technologies of power module are greatly simplified. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer's drawings or samples

Applied Area
 

* Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control  * Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors 

 * Home Appliance: Air Conditioner, Peltier Cooler 

 * Industrial: LED Displays, Welding Machine

 * Aerospace: Laser, Power Supply for Satellites and Aircrafts 

 * Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power
 
 * PC/IT: Power Supply, UPS System

Ceramic Materials Properties
1. High Thermal Conductivity 
2. Low Thermal Expansion 
3. High Strength 
4. High Wettability for Solder

DBC Design Guide
Item	Unit	Value
Master Card Size	mm	138x190 ±1.5%
		USABLE AERA 127×178
Dimension Tolerance	mm	-4
Copper Edge to Ceramic Edge	mm	±0.15
Pattern Mismatch	mm	≤0.2
Etch Factor	-	>2
Chip	t	L : max.1, W&D : 0.5
Total Thickness	%	±7
Surface Roughness	μm	Rmax=50 ; Ra≤3 ; Rz≤16
Plating Thickness	μm	Au: 0.01~0.1; Ni: 2~8

Available Material Thickness and Combination
96% Al2O3	Copper Thickness
Thickness	0.127	0.2	0.25	0.3	0.4	0.5
0.25	√	√	√	-	-	-
0.32	√	√	√	√	-	-
0.38	√	√	√	√	-	-
0.5	√	√	√	√	√	√
0.635	√	√	√	√	√	√
1	√	√	√	√	√	√

ZTA	Copper Thickness
Thickness	0.127	0.2	0.25	0.3	0.4	0.5
0.25	√	√	√	√	-	-
0.32	√	√	√	√	√	√

AlN	Copper Thickness
Thickness	0.127	0.2	0.25	0.3	0.4	0.5
0.38	√	√	√	√	-	-
0.5	√	√	√	√	√	√
0.63	√	√	√	√	√	√
1	√	√	√	√	√	√

Material Specification & Properties
Item	Al2O3	ZTA	ALN	Unit
Content	96% Al2O3	90%Al2O3	-	%
		9%ZrO2
Density	3.75	3.95	3.3	g/m³
Thermal Conductivity	>24	>27	>170	W/m.K
Electrical Resistivity	>1014	>1014	>1014	Ω·cm
Dielectric Constant	9.8	10.5	9	1Mhz
Dielectric Strength	>20	>20	>20	KV/mm
Dielectric Loss	0.0003	0.0003	0.0005	1Mhz
Bending Strength	>350	>600	>350	MPa
(Σ0,M>10)
Young’s Modulus	340	310	320	Gpa
Coefficient of Thermal Expansion	6.8	7.5(40℃~400℃)	4.7	x10-6/K
	20℃~300℃)	8.4(40℃~800℃)	(20℃~300℃)