Innovacera Plating with Ni Aluminum Nitride / Beo / Alumina Dbc Ceramic Substrate
Product Details
| Application: | Aerospace, Electronics, Medical, Refractory |
|---|---|
| Conductive Layer: | Thick Copper Layer |
| Material: | Al2O3 |
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Basic Info.
- Model NO.
- INCA029
- Process
- Direct Bonded Copper
- Thickness
- Customized
- Vickers Hardness
- 11
- Dielectric Loss
- 9
- Shape
- Plate
- Max Use Temperature
- 1400°c
- Color
- White
- Hardness
- 11.5
- Thermal Conductivity
- 24.7
- Processing Service
- Moulding, Active Metal Bonding
- Density
- 3.6-3.7
- Flexural Strength
- 300MPa
- Material Composition
- Alumina, Al2O3
- Speciality
- High Insulation, High Strength
- Type
- Ceramic Plates
- Transport Package
- Carton Packing
- Specification
- Customized
- Trademark
- INNOVACERA
- Origin
- Fujian, China
- Production Capacity
- 200000 Piece/Pieces Per Month
Product Description
DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century.
DBC Substrate Features:
1.High mechanical strength,mechanically stable shape;high strength,fine thermal conductivity,excellent electrical
isolation;good adhesion,corrosion resistant;
2.Much better thermal cycling capabilities (up to 50000 cycles),high reliability;
3.May be structured just like PCB boards or IMS substrates to get etched wiring;
4.No contamination,environmentally clean;
5.Wide application temperature:-55 ~ 850; The thermal expansion coefficient is closed to that of silicon, so production technologies of power module are greatly simplified. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer's drawings or samples
DBC Substrate Features:
1.High mechanical strength,mechanically stable shape;high strength,fine thermal conductivity,excellent electrical
isolation;good adhesion,corrosion resistant;
2.Much better thermal cycling capabilities (up to 50000 cycles),high reliability;
3.May be structured just like PCB boards or IMS substrates to get etched wiring;
4.No contamination,environmentally clean;
5.Wide application temperature:-55 ~ 850; The thermal expansion coefficient is closed to that of silicon, so production technologies of power module are greatly simplified. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer's drawings or samples
Applied Area
* Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control * Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors
* Home Appliance: Air Conditioner, Peltier Cooler
* Industrial: LED Displays, Welding Machine
* Aerospace: Laser, Power Supply for Satellites and Aircrafts
* Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power
* PC/IT: Power Supply, UPS System
Ceramic Materials Properties
1. High Thermal Conductivity
2. Low Thermal Expansion
3. High Strength
4. High Wettability for Solder
1. High Thermal Conductivity
2. Low Thermal Expansion
3. High Strength
4. High Wettability for Solder
DBC Design Guide | ||
Item | Unit | Value |
Master Card Size | mm | 138x190 ±1.5% |
USABLE AERA 127×178 | ||
Dimension Tolerance | mm | -4 |
Copper Edge to Ceramic Edge | mm | ±0.15 |
Pattern Mismatch | mm | ≤0.2 |
Etch Factor | - | >2 |
Chip | t | L : max.1, W&D : 0.5 |
Total Thickness | % | ±7 |
Surface Roughness | μm | Rmax=50 ; Ra≤3 ; Rz≤16 |
Plating Thickness | μm | Au: 0.01~0.1; Ni: 2~8 |
Available Material Thickness and Combination | ||||||
96% Al2O3 | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.25 | √ | √ | √ | - | - | - |
0.32 | √ | √ | √ | √ | - | - |
0.38 | √ | √ | √ | √ | - | - |
0.5 | √ | √ | √ | √ | √ | √ |
0.635 | √ | √ | √ | √ | √ | √ |
1 | √ | √ | √ | √ | √ | √ |
ZTA | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.25 | √ | √ | √ | √ | - | - |
0.32 | √ | √ | √ | √ | √ | √ |
AlN | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.38 | √ | √ | √ | √ | - | - |
0.5 | √ | √ | √ | √ | √ | √ |
0.63 | √ | √ | √ | √ | √ | √ |
1 | √ | √ | √ | √ | √ | √ |
Material Specification & Properties | ||||
Item | Al2O3 | ZTA | ALN | Unit |
Content | 96% Al2O3 | 90%Al2O3 | - | % |
9%ZrO2 | ||||
Density | 3.75 | 3.95 | 3.3 | g/m³ |
Thermal Conductivity | >24 | >27 | >170 | W/m.K |
Electrical Resistivity | >1014 | >1014 | >1014 | Ω·cm |
Dielectric Constant | 9.8 | 10.5 | 9 | 1Mhz |
Dielectric Strength | >20 | >20 | >20 | KV/mm |
Dielectric Loss | 0.0003 | 0.0003 | 0.0005 | 1Mhz |
Bending Strength | >350 | >600 | >350 | MPa |
(Σ0,M>10) | ||||
Young’s Modulus | 340 | 310 | 320 | Gpa |
Coefficient of Thermal Expansion | 6.8 | 7.5(40℃~400℃) | 4.7 | x10-6/K |
20℃~300℃) | 8.4(40℃~800℃) | (20℃~300℃) | ||
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