Glass-to-Metal Seals Cases for High Frequency Chips Packing

Product Details
Application: High-Pressure Seals
Plated Layer: Gold / Sliver / Ni / Tin Plating
Processing Service: Welding, Moulding
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  • Glass-to-Metal Seals Cases for High Frequency Chips Packing
  • Glass-to-Metal Seals Cases for High Frequency Chips Packing
  • Glass-to-Metal Seals Cases for High Frequency Chips Packing
  • Glass-to-Metal Seals Cases for High Frequency Chips Packing
  • Glass-to-Metal Seals Cases for High Frequency Chips Packing
  • Glass-to-Metal Seals Cases for High Frequency Chips Packing
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Basic Info.

Plating
* Gold Plating * Silver Plating
Material Composition
Alumina, Al2O3
Speciality
High Insulation, High Strength
Type
Ceramic Parts
Transport Package
Standard Cartons with Foam
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China
Production Capacity
20000 Piece/Pieces Per Month

Product Description

 
Glass-To-Metal Seals and Feedthroughs, where glass is heated to a molten state and then wetted to the metal, creating a tight bond while carefully controlling the thermal expansion of both materials to prevent breakage.
 
* Glass is heated to a molten state then wetted to the metal, forming a tight bond.
* The thermal expansion of the glass and the metal are carefully measured and controlled to prevent breakage.
INNOVACERA offers not only electrical feedthroughs, the most common type we make, but also RF and microwave feedthroughs.
Materials:
* Body materials: Cold rolled steels, Stainless steel, Inconel, etc.
* Glass Materials: Soda lime, Lead silicate, etc.
* Electrodes Material: Alloy 52, Copper Cored 52 Alloy, Alloy 42, etc.
Typically Compression Seals withstand temperatures ranging from -250°C to 400°C. Allowable operating temperatures would be from -60°C to 200°C under thermal cycling and shock.
 
 
Plating:
* Gold Plating
* Silver Plating
* Electrolytic and Electroless Ni Plating
* Tin Plating

 
Glass-to-Metal Seals Cases for High Frequency Chips Packing
Glass-to-Metal Seals Cases for High Frequency Chips Packing
Glass-to-Metal Seals Cases for High Frequency Chips Packing
Glass-to-Metal Seals Cases for High Frequency Chips Packing

 
Alumina Ceramic Property
Property
Unit
92% Alumina Ceramic
95% Alumina Ceramic
99% Alumina Ceramic
Density
g/cm3
≥3.63
≥3.68
≥3.83
Water absorption
%
O
O
O
Sintering temperature
°C
1500-1700
1600-1800
1700-1800
Hardness
HV
≥1400
≥1500
≥1650
Flexural strength
Kgf/cm2
3000
3000
3000
Compressive strength
Kgf/cm2
24000
25000
26000
Fracture toughness
Map.m3/2
3~4
3~4
4~5
Maximum temperature
°C
1600
1700
1800
Coefficient of thermal expansion
/°C
8*10-6
8*10-6
8*10-6
Heat shock
T(°C)
220
220
220
Thermal conductivity
W/m.k(25-300°C)
25 14
25 14
25 14
 
20°C
 
>1012
>1012
>1012

 

 
 
 
 

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