Metallized Dcb Dbc Aln Ceramic Substrate with Copper

Product Details
Application: Aerospace, Electronics, Medical
Compressive Strength: 2300MPa
Coating Thickness: 8-30μm
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  • Metallized Dcb Dbc Aln Ceramic Substrate with Copper
  • Metallized Dcb Dbc Aln Ceramic Substrate with Copper
  • Metallized Dcb Dbc Aln Ceramic Substrate with Copper
  • Metallized Dcb Dbc Aln Ceramic Substrate with Copper
  • Metallized Dcb Dbc Aln Ceramic Substrate with Copper
  • Metallized Dcb Dbc Aln Ceramic Substrate with Copper
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Overview

Basic Info.

Model NO.
INC-DBC20310
Coating Layer
Mo/Mn
Plated Layer
Nickel/Copper/Gold etc.
Thermal Conductivity
25W/(M.K)
Plating Thickness
2-9μm
Max. Use Temperature
1600ºC
Density
3.7g/cm3
Material Composition
Alumina, Al2O3
Speciality
High Insulation, High Strength, Temperature Resistant
Type
Insulating Ceramics
Transport Package
Standard Cartons with Foam
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China
Production Capacity
1000 Piece/Pieces Per Month

Product Description

Metallized Dcb Dbc Aln Ceramic Substrate with Copper

 

DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century.
 
DBC Substrate Features:
1.High mechanical strength,mechanically stable shape;high strength,fine thermal conductivity,excellent electrical
isolation;good adhesion,corrosion resistant;
2.Much better thermal cycling capabilities (up to 50000 cycles),high reliability;
3.May be structured just like PCB boards or IMS substrates to get etched wiring;
4.No contamination,environmentally clean;
5.Wide application temperature:-55 ~ 850; The thermal expansion coefficient is closed to that of silicon, so production technologies of power module are greatly simplified. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer's drawings or samples
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Recommend Products
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Product Classification
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Company Profile
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Why Choose Us
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Product packaging
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
Browse More Products
Metallized Dcb Dbc Aln Ceramic Substrate with Copper
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