Alumina / Ain / Beo Mo Mn Metallized Ceramic Substrate

• Application: Aerospace, Electronics, Medical, Industrial Ceramic
• Dielectric Loss: 0.0003
• Shape: Plate
• Model NO.: DBC Ceramic Substrate
• Max Use Temperature: 300°c
• Thermal Conductivity: 170
• Processing Service: Moulding, Active Metal Bonding
• Density: 3.3-3.7
• Material Composition: Alumina, Al2O3
• Speciality: Temperature Resistant
• Type: Ceramic Plates
• Transport Package: Vaccum&Carton Packaging
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 100000 Piece/Pieces Per Month

Product Description

Product Description

DBC ceramic substrate/for electronic heating devices / Innovacera

1. DBC ceramic substrate:
Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it.

 

1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo, Mn, Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation

Advantages of DBC ceramic substrate:
>high mechanical strength
>fine thermal conducticity
>excellent electrical isolation
>good adhesion
>corrosion resistant
>high reliability
>environmentally clean

Applications of DBC ceramic substrate:
1.power semiconductor modules
2.semiconductor refrig-erators
3.power control circuits
4.high frequency switch mode power suppliers
5.solid-state relays
6.Solar-panel arrays
7.telecommunications private branch exchange and receiving system industrial electronics

 

Detailed Photos

 

Alumina Ceramics Properties
	Unit	95%	99%
Density	g/cm3	3.6	3.8
Water absorption	%	<0.4	<0.2
Firing temperature	°C	1600	1800
Hardness	HRA	70	80
Coefficientoflinearexpansion	*10-6/°C	5.5	5.3
Dielectric constant		9	10.5
Volume resistivity	Ω·cm	-	1013
Breakdownvoltage	KV/mm	14	15
Breaking strength	Mpa	250	300

 

Company Profile

SEND ME

If you are interested in our products, please click here to send me an inquiry, and I will reply you within 8 hours