Innovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic Packages

Product Details
Application: Aerospace, Electronics, Medical, IGBT, Power Mosfet, Super Junction Mosfet, Diode
Type: Ceramic Plates
Maximum Use Temperature: 1600ºC
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  • Innovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic Packages
  • Innovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic Packages
  • Innovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic Packages
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Basic Info.

Flexural Strength
≥450MPa
Color
Grey
Dielectric Strength
≥17kv/mm
Dielectric Constant
8-10 1MHz
Thermal Conductivity
≥170W/M.K
Processing Service
Moulding
Density
≥3.33G/Cm3
Thermal Expansion Coefficient
(4.0-6.0)X10-6/ºC
Transport Package
Carton Package
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China

Product Description

 
 


Aluminum Nitride Ceramic (AlN) is a special ceramic material that combines high thermal conductivity with high electrical resistivity. Only a few ceramics possess high thermal conductivity: Such as Beryllium Oxide (BeO) and cubic Boron Nitride (c-BN) are virtually the only other examples. However, the use of BeO is restricted due to its powder toxicity, and c-BN is very difficult to produce.

Also, the material is suitable for further processing with thick and thin-film technology aluminum nitride is an ideal material for applications in telecommunications technology.

Aluminum nitride ceramic is therefore used as a substrate for semiconductors, as well as for high-power electronic parts, housings, and heat sinks.

 
Innovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic Packages
Application:
-Heat sinks & heat spreaders
-Chucks, clamp rings for semiconductor processing equipment
-Electrical insulators
-Silicon wafer handling and processing
-Substrates & insulators for microelectronic devices & opto electronic devices
-Substrates for electronic packages
-Chip carriers for sensors and detectors
-Laser heat management components
 

 
Innovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic Packages
Innovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic Packages
 
Aluminium Nitride Material Properties
Material
ALN
Item No.
INC-AN180
INC-AN200
INC-AN220
Color
Gray
Gray
Beige
Main Content
96%ALN
96%ALN
97%ALN
Main Characteristics
High Thermal Conductivity,Excellent Plasma Resistance
Main Applications
Heat Dissipating Parts,Plasma Resistance Parts
Bulk Density
3.30
3.30
3.28
Water Absorption
0
0
0
Vickers Hardness(Load 500g)
10.0
9.5
9.
Flexural Strength
>=350
>=325
>=280
Compressive Strength
2500
2500
-
Young' Modulus of Elasticity
320
320
320
Poisson's Ratio
0.24
0.24
0.24
Fracture Toughness
-
-
-
Coefficient Linear Thermal Expansion
40-400degree
4.8
4.6
4.5
Thermal Conductivity
20degree
180
200
220
Specific Heat
0.74
0.74
0.76
Thermal Shocking Resistance
-
-
-
Volume Resistivity
20degree
>=10-14
>=10-14
>=10-13
Dielectric Strength
>=15
>=15
>=15
Dielectric Constant
1MHz
9
8.8
8.6
Loss Tangent
*10-4
5
5
6

Innovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic PackagesInnovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic PackagesInnovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic PackagesInnovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic PackagesInnovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic PackagesInnovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic PackagesInnovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic PackagesInnovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic PackagesInnovacera Aln Heat Sink Aluminum Nitride Ceramic Heating Element for Electronic Packages

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