High Temperature Aln Aluminum Nitride Ceramic Tray Heating Plate for Semiconductor Industry

• Application: Aerospace, Electronics, Medical, Industrial Ceramic
• Type: Ceramic Plates
• Flexural Strength: >=450MPa
• Surface Roughness: 0.3-0.6um
• Color: Gray
• Volume Density: >=3.3G/Cm3
• Model NO.: INCA03
• Water Absorption: 0
• Thermal Conductivity: >=180W/M.K
• Thermal Expansivity: 4.8*10-6
• Processing Service: Cutting, Punching, Moulding, Laser Cutting
• Transport Package: Vacuum Packing
• Specification: Customized
• Trademark: Innovacera
• Origin: Fujian, China
• Production Capacity: 100 Piece/Pieces Per Month

Product Description

Aluminum nitride heater function

The thermal conductivity is equivalent to aluminum, which can achieve a fast and uniform thermal response

. Watt density: up to 2000 W/in ² (310 W/cm ²)

. Aluminum nitride thermal conductivity: 170 W/mK

. Rapid heating rate: 0-400°C (32 to 752°F), less than 2 seconds . Atmospheric and inert gas environment applications . Complex 3D Geometry . Thickness: 0.05 inches to 0.200 inches (1.27 mm to 5.08 mm) . Size: up to 10.25 inches 2 (66.13 cm²)

 

 

Application

 

 

 

- RF / Microwave Components

- Power Modulus

- Power Transformers

- High Power LED Package

 

 

- Laser Diode Sub-mounts

- LED Chip Sub-mount

- Microelectronic Packages

- Transistors
 

- High Thermal Conductivity Substrates for LED & Power Electronics

- Substrates for Power Electronics

 

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