High Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch Equipment

Product Details
Application: Aerospace, Electronics, Medical, Industrial Ceramic
Type: Ceramic Plates
Mechanical Strength: 450MPa
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  • High Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch Equipment
  • High Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch Equipment
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  • Product Description
Overview

Basic Info.

Size
Customer′s Drawing
Color
Black
Heat Conductivity Coefficient
100-140W/M.K
Insulating Property
15kv/mm
Water Absorption
0 %
Density
≥3.32g/cm3
Advantage
Corrosion Resistance
Product Name
Aluminum Nitride
Certificate
RoHS
Transport Package
Carton Packing
Specification
Customized
Trademark
IINNOVACERA
Origin
Fujian, China
Production Capacity
10000 Piece/Pieces Per Month

Product Description

 
Product Description

Innovacera designs Aluminum Nitrides (AlN) nozzles for precise gas flow rate and uniform control to evenly disperse gases into the etch process chamber. These components require high plasma resistance, dielectric strength, and strong corrosion resistance to the process gases and byproducts.

 
Key Properties:
High thermal stability
Low thermal expansion
High thermal conductivity
High thermal shock resistanc
 
Applications:
High thermal stability
Low thermal expansion
High thermal conductivity
High thermal shock resistance


Hot Pressed Alumina Nitride Properties:

Aluminum Nitride Material Properties
Properties INC-AN180 INC-AN200 INC-AN220
Color   Gray Gray Beige
Main Content   96%ALN 96%ALN 97%ALN
Main Characteristics   High Thermal Conductivity, Excellent Plasma Resistance
Main Applications   Heat Dissipating Parts, Plasma Resistance Parts
Bulk Density   3.30 3.30 3.28
Water Absorption   0.00 0.00 0.00
Vickers Hardness(Load 500g)   10.00 9.50 9.00
Flexural Strength   >=350 >=325 >=280
Compressive Strength   2,500.00 2,500.00 -
Young's Modulus of Elasticity   320.00 320.00 320.00
Poisson's Ratio   0.24 0.24 0.24
Fracture Toughness   - - -
Coefficient Linear Thermal Expansion 40-400 degree Celsius 4.80 4.60 4.50
Thermal Conductivity 20 degree Celsius 180.00 200.00 220.00
Specific Heat   0.74 0.74 0.76
Thermal Shocking Resistance   - - -
Volume Resistivity 20 degree Celsius >=10-14 >=10-14 >=10-13
Dielectric Strength   >=15 >=15 >=15
Dielectric Constant 1MHz 9.00 8.80 8.60
Loss Tangent *10-4 5.00 5.00 6.00
Remark: The value is just for review, different using conditions will have a little difference.
High Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch Equipment
 
 
 
 
 
 
High Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch EquipmentHigh Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch EquipmentHigh Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch EquipmentHigh Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch EquipmentHigh Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch EquipmentHigh Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch EquipmentHigh Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch EquipmentHigh Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch EquipmentHigh Thermal Conductivity Aluminum Nitrides Aln Nozzles for Plasma Etch Equipment

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