High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc

Product Details
Application: Aerospace, Electronics, Medical, Industrial Ceramic
Type: Ceramic Plates
Transport Package: Vacuum Packing
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  • High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc
  • High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc
  • High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc
  • High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc
  • High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc
  • High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc
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Basic Info.

Model NO.
AA Aluminum Nitride Ceramic Disc
Specification
Customized
Trademark
Innovacera
Origin
Fujian, China
Production Capacity
1000 Piece/Pieces Per Month

Product Description

Aluminum Nitride combines high thermal conductivity with strong electrical resistance. They are an excellent solution for many electronic applications- allowing electrical systems to dissipate heat quickly for maximum efficiency.

Thermal conductivity measures how well a material spreads heat within itself. Cooking pans have high thermal conductivity allowing evenly distributed heat to pass quickly into the food. On the other hand, insulative gloves are used to handle hot objects because their low thermal conductivity prevents heat from transmitting to sensitive hands. Technical ceramics are extraordinarily versatile, exhibiting a wide range of thermal conductivity.
 

High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc
High Thermal Conductivity Aln Aluminum Nitride Ceramic Disc

 

Below is our Aluminum Nitride Ceramic material data sheet.

Aluminium Nitride Material Properties
Properties Value
Bulk Density(g/cm3)   >=3.3
Water Absorption   0.00
Flexural Strength(MPa)   >300
Vickers Hardness (Gpa)   11.00
Modulus Of Elasticity  (Gpa)   >200
Dielectric Constant(1MHz)   8.80
Coefficient Linear Thermal Expansion /ºC,5ºC/min, 20-300ºC 4.6*10-6
Thermal Conductivity 30 degree Celsius >=170
Volume Resistivity(Ω.cm) 20 degree Celsius  >1014
300 degree Celsius  109
500 degree Celsius  107
Dielectric Strength(KV/mm)   15-20
Remark: The value is just for review, different using conditions will have a little difference.

 

Infineon has officially launched the new EasyDUAL™ CoolSiC™ power module, which uses aluminum nitride ceramics and has a half-bridge structure. It is suitable for 1200V high-power application scenarios, including solar uninterruptible power systems, auxiliary inverters, energy storage systems, and electric vehicle chargers. The CoolSiC module technology equipped with aluminum nitride ceramics can reduce the thermal resistance of the heat sink by up to 40%, which can increase the output power or reduce the operating temperature and improve the service life of the system.

We will work with you to find the optimal material for your application.

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