High Thermal Conductivity Wear Resistant Customized Ceramic Tube Ain Ceramic Part HP Aln Ceramic

• Application: Aerospace, Electronics, Medical, Refractory
• Type: Plate
• Flexural Strength: 450MPa
• Surface Roughness: Ra 0.3-0.5
• Color: Grey
• Coefficient of Thermal Expansion: 4.8
• Model NO.: INC-AlN201158
• Thermal Conductivity: (25°c) 180 W/Mk
• Water Absorption: 0
• Density: 3.31g/cm3
• Melting Point: 2500
• Transport Package: Standard Safety Cartons with Plastic Foams
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 10000 Piece/Pieces Per Month

Product Description

AlN Ceramic Structural Parts

Due to high thermal conductivity and electrical insulation properties ,Aluminum Nitride is an ideal material for use in thermal
management and electrical applications. Additionally, Aluminum Nitride is also a common alternative to Beryllium Oxide (BeO) in
the semiconductor industry as it is not a health hazard when machined. Aluminum Nitride has a coefficient of thermal expansion and
electrical insulation properties that closely matches that of Silicon wafer material, making it an useful material for electronics
applications where high temperatures and heat dissipation is often a problem.

Application:

-Heat sinks & heat spreaders
-Chucks, clamp rings for semiconductor processing equipment
-Electrical insulators
-Silicon wafer handling and processing
-Substrates & insulators for microelectronic devices & opto electronic devices
-Substrates for electronic packages
-Chip carriers for sensors and detectors
-Laser heat management components

 

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