Factory Price Wear Resistance MOS Transistor IGBT Aln Aluminum Nitride Thermal Pad Substrate for Cooling Pad with Hole

• Application: Electronic Devices, Semiconductors, Industrial Ceramic
• Material: Aluminum Nitrid
• Volume Resistance: 10(13) Ω`Cm
• Color: Grey
• Coefficient of Thermal Expansion: 4.8X10(-6)mm/℃
• Thermal Conductivity: (25°c) 180 W/Mk
• Water Absorption: 0
• Processing Service: Moulding
• Density: >3.3G/Cm3
• Flexural Strength: >310MPa
• Surface Roughness: Ra 0.3-0.5
• Melting Point: 2500
• Part No.: to-3p
• Type: Ceramic Plates
• Transport Package: Carton Packing
• Specification: 25mm*20mm*1mm
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

 

Aluminum nitride ceramic thermal insulator pads are ceramic materials with outstanding properties such as high thermal conductivity and high electrical resistance. In addition, it is featured advantages such as high hardness, corrosion resistance,low dielectric constant and dielectric loss, and low CTE. Aluminum nitride ceramics have excellent thermal conductivity (7-10 times that of alumina ceramics), as the thermal expansion coefficient of silicon is similar, as a new generation of ceramic materials, more and more people pay attention to it.

 

Product Name: Aluminum Nitride Ceramic Thermal Pads For MOSFET Transistor IGBT Transistor Heat Sink

Part No.: TO-3P TO-220 TO247 TO-254 TO-257 TO-258 TO-264

 

Application: for MOS Transistor IGBT Transistor Heat Sink Often used in electrical and electronic fields requiring heat conduction, heat dissipation, insulation, high temperature resistance,high voltage breakdown resistance, high thermal conductivity, good stability.

 

Product Advantages:

> Excellent thermal conductivity (7-10 times of alumina ceramics) > Low dielectric constant

> Dielectric loss

> Reliable insulation performance

> Excellent mechanical properties

> Non-toxic > High temperature resistance

> Chemical corrosion resistance

 

Application: communication devices, high brightness LED, power electronic devices and other industries.

 

Aluminum Nitride Thermal Pad Information
PS:    K -  Hole Diameter     T  -  Thickness      24  -  Aluminum Nitride
Part No.	Material	Specification	Others
TO-3P-K3.8-T0.6-24	AlN	25*20*0.635mm	with Hole
TO-3P-K3.8-T1-24	AlN	25*20*1mm	with Hole
TO-3P-T0.6-24	AlN	25*20*0.635mm	without holes
TO-3P-T1-24	AlN	25*20*1mm	without holes
TO-220-T0.6-24	AlN	20*14*0.635mm	without holes
TO-220-T1-24	AlN	20*14*1mm	without holes
TO-220-K3.2-T0.6-24	AlN	20*14*0.635mm	with Hole
TO-220-K3.2-T1-24	AlN	20*14*1mm	with Hole
TO-247-T0.6-24	AlN	22*17*0.635mm	without holes
TO-247-T1-24	AlN	22*17*1mm	without holes
TO-247-K3.7-T0.6-24	AlN	22*17*0.635mm	with Hole
TO-247-K3.7-T1-24	AlN	22*17*1mm	with Hole
TO-254-T0.6-24	AlN	34*24*0.635mm	without holes
TO-254-T1-24	AlN	34*24*1mm	without holes
TO-254-K3.8-T0.6-24	AlN	34*24*0.635mm	with Hole
TO-254-K3.8-T1-24	AlN	34*24*1mm	with Hole
TO-257-T0.6-24	AlN	40*28*0.635mm	without holes
TO-257-T1-24	AlN	40*28*1mm	without holes
TO-258-T0.6-24	AlN	50.8*50.8*0.635mm	without holes
TO-258-T1-24	AlN	50.8*50.8*1mm	without holes
TO-264-K3.4-T0.6-24	AlN	28*22*0.635mm	with Hole
TO-264-K3.4-T1-24	AlN	28*22*1mm	with Hole
TO-264-T0.6-24	AlN	28*22*0.635mm	without holes
TO-264-T1-24	AlN	28*22*1mm	without holes

Product Parameters

Properties
Properties	Unit	INC-AN180	INC-AN200	INC-AN220
Color		Gray	Gray	Beige
Density	g/cm3)	3.3	3.3	3.28
Thermal conducitivity	(W/m.K) in 20°C	180	200	220
Bending strength	(Mpa	>=350	>=325	>=280
Insulation	(KV/mm)	31	27	27
Dielectric		9	8.8	8.6
CTE (10-6)		4.8	4.6	4.5

Available Sizes and Machining Capability
 

Availability	Sizes (mm)	Machining Capability	Sizes (mm)
Plate	Φ350×30	Hole diameter	Φ0.03 or more
Rod	Φ100×200	Hole depth	300 or less
Groove width	0.05 or more	Max. hole number	3,000 (approx.)
Max. step height	30	Thread size	M2 or more

 

 

 

Detailed Photos