Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

• Application: Electronic Devices, Semiconductors, Aerospace, Electronics, Medical, Refractory
• Conductive Layer: Thick Copper Layer
• Material: Al2O3
• Process: Direct Bonded Copper
• Thickness: Customized
• Shape: Plate, Tube
• Volum Resistivity: >10^(14)Ω .Cm
• Size: Customized Size
• Color: White
• Thermal Shock Resistance: 250 T( C)
• Density: 3.6g/cm3
• Function: Welding Machine
• Flexural Strength: 345-358 MPa
• Thermal Conductivity: 25 W/M.K
• Water Absorption: 0
• Material Composition: Alumina, Al2O3
• Speciality: High Insulation
• Type: Ceramic Plate
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

Metallized Ceramic Componenets:

Innovacera supplies precision metallized ceramic parts in aluminum oxide ceramics for the aerospace industries. Through spray, needle, and brush coatings or screen printing our capabilities allow us to metallized on flat, cylindrical, and complex ceramic bodies. Moly-Manganese is the typical base coat materials used for metallization.In order to achieve the welding between ceramic and metal, the ceramic surface firmly adheres to a layer of the metal film, which is ceramic metallization.Refractory-metalized aluminum oxide ceramics widely use in power grid tubes, vacuum interrupters, and similar applications where metal to ceramic joints of exceptional strength and hermeticity is required.

 

Product Name	Metallized Ceramics Componenets ( Tube, Ring, Plate, Rod, Substrate . . . )
Material	95%, 96%, 99% Alumina (AL2O3)
Color	White+Metal
Coaing Layer	Mo/Mn
Coaing thickness	8-30um
Plated Layer	Ni,Cu,Au,Etc
Plating thickness	1-9um
Brade	INNOVACERA

Specification

>Metallization thickness: 25 ±10um

>Nickel thickness:2~10um;

>Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)

Available Ceramic Composition >94%,96%,99%,99.6% Alumina Ceramic Components;

>AlN Ceramic Substrate;

>BeO Ceramic Substrate;

Special process

Metallization and Brazing are possible Our processing is available in a wide range of size and shapes as customer request.

Metallized Ceramic Components Joining types:

Ceramic + Mo/Mn Metallized + plating Ni

Ceramic + Mo/Mn Metallized + plating Ag

Ceramic + Mo/Mn Metallized + plating Au

Ceramic + Printing Ag
Special types are available according to customer's drawings or samples
 

Characteristics:

Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products

 

Material Properties:

Great mechanical strength Excellent wear resistance Low thermal expansion High operating temperatures Electrically insulating

Types of Metallization Ceramic Substrates

DBC (Direct Bonded Copper)

It is composed of ceramic substrate, bonding bonding layer and conductive layer. It refers to the special process of copper foil directly bonding to alumina or aluminum nitride ceramic substrate surface at high temperature.

 

Advantages: >The copper layer is thick; >The processing is fast; >The price is cheap; >Can make multilayer; >Suitable for large area consumption; >High thermal conductivity; >High adhesion strength; >Excellent soft brazing; >Excellent electrical insulation

 

DPC (Direct Plated Copper)

Mainly by evaporation, magnetron sputtering and other surface deposition process to carry on the substrate surface metallization, first under the condition of vacuum sputtering, titanium, and then is copper particles, the plating thickness, then finish making line with ordinary PCB craft, and then to plating/electroless deposition way to increase the thickness of the line, the preparation of DPC way contains vacuum coating, wet deposition,Exposure development, etching and other processes.

 

Advantages: > In terms of shape processing, DPC ceramic plate needs to be cut by laser, the traditional drilling and milling machine and punch machine can not be accurately processed, so the combination force and line width is also more fine. > The crystal performance of the metal is good; > The flatness is good; > The line is not easy to fall off; > The line position is more accurate, the line distance is smaller, reliable and stable, can be through the hole and other advantages.

 

AMB(Active Metal Brazing)

It is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal.

 

Advantages: The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better
 

 

Thick film ceramic substrate

Thick film technology, it is straight on ceramic substrate printed graphics, then direct sintering process.

 

Advantages: > The bonding force with ceramic is much greater than that of the DPC process; > It is direct printing of graphics,no etching and copper plating process, so the cost will be lower; > It is one-time forming, so the flatness is smoother than that of the DPC.
 

Material Specification and Properties