Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
Product Details
| Application: | Aerospace, Electronics, Medical, Refractory |
|---|---|
| Conductive Layer: | Thick Copper Layer |
| Material: | Al2O3 |
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Basic Info.
- Process
- Direct Bonded Copper
- Thickness
- Customized
- Vickers Hardness
- 11
- Dielectric Loss
- 9
- Shape
- Plate
- Max Use Temperature
- 1400°c
- Color
- White
- Hardness
- 11.5
- Thermal Conductivity
- 24.7
- Processing Service
- Moulding, Active Metal Bonding
- Density
- 3.6-3.7
- Flexural Strength
- 300MPa
- Material Composition
- Alumina, Al2O3
- Speciality
- High Insulation, High Strength
- Type
- Ceramic Plates
- Transport Package
- Carton Packing
- Specification
- Customized
- Trademark
- INNOVACERA
- Origin
- Fujian, China
Product Description
DBC substrate short for Direct Bonded Copper substrate is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications.
1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation
Applied Area
* Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control * Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors
* Home Appliance: Air Conditioner, Peltier Cooler
* Industrial: LED Displays, Welding Machine
* Aerospace: Laser, Power Supply for Satellites and Aircrafts
* Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power
* PC/IT: Power Supply, UPS System
Ceramic Materials Properties
1. High Thermal Conductivity
2. Low Thermal Expansion
3. High Strength
4. High Wettability for Solder
1. High Thermal Conductivity
2. Low Thermal Expansion
3. High Strength
4. High Wettability for Solder
DBC Design Guide | ||
Item | Unit | Value |
Master Card Size | mm | 138x190 ±1.5% |
USABLE AERA 127×178 | ||
Dimension Tolerance | mm | -4 |
Copper Edge to Ceramic Edge | mm | ±0.15 |
Pattern Mismatch | mm | ≤0.2 |
Etch Factor | - | >2 |
Chip | t | L : max.1, W&D : 0.5 |
Total Thickness | % | ±7 |
Surface Roughness | μm | Rmax=50 ; Ra≤3 ; Rz≤16 |
Plating Thickness | μm | Au: 0.01~0.1; Ni: 2~8 |
Available Material Thickness and Combination | ||||||
96% Al2O3 | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.25 | √ | √ | √ | - | - | - |
0.32 | √ | √ | √ | √ | - | - |
0.38 | √ | √ | √ | √ | - | - |
0.5 | √ | √ | √ | √ | √ | √ |
0.635 | √ | √ | √ | √ | √ | √ |
1 | √ | √ | √ | √ | √ | √ |
ZTA | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.25 | √ | √ | √ | √ | - | - |
0.32 | √ | √ | √ | √ | √ | √ |
AlN | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.38 | √ | √ | √ | √ | - | - |
0.5 | √ | √ | √ | √ | √ | √ |
0.63 | √ | √ | √ | √ | √ | √ |
1 | √ | √ | √ | √ | √ | √ |
Material Specification & Properties | ||||
Item | Al2O3 | ZTA | ALN | Unit |
Content | 96% Al2O3 | 90%Al2O3 | - | % |
9%ZrO2 | ||||
Density | 3.75 | 3.95 | 3.3 | g/m³ |
Thermal Conductivity | >24 | >27 | >170 | W/m.K |
Electrical Resistivity | >1014 | >1014 | >1014 | Ω·cm |
Dielectric Constant | 9.8 | 10.5 | 9 | 1Mhz |
Dielectric Strength | >20 | >20 | >20 | KV/mm |
Dielectric Loss | 0.0003 | 0.0003 | 0.0005 | 1Mhz |
Bending Strength | >350 | >600 | >350 | MPa |
(Σ0,M>10) | ||||
Young’s Modulus | 340 | 310 | 320 | Gpa |
Coefficient of Thermal Expansion | 6.8 | 7.5(40℃~400℃) | 4.7 | x10-6/K |
20℃~300℃) | 8.4(40℃~800℃) | (20℃~300℃) | ||
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