Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

Product Details
Application: Aerospace, Electronics, Medical, Refractory
Material: Al2O3
Process: Direct Bonded Copper
Manufacturer/Factory & Trading Company

360° Virtual Tour

Diamond Member Since 2024

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Self-branded
The supplier has 2 Self-brands, check the Audit Report for more information
QA/QC Inspectors
The supplier has 3 QA and QC inspection staff
R&D Capabilities
The supplier has 2 R&D engineers, you can check the Audit Report for more information
Product Certification
The supplier's products already have relevant certification qualifications, including:
CE
to see all verified strength labels (26)
  • Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
  • Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
  • Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
  • Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
  • Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
  • Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
Find Similar Products
  • Overview
  • Material Specification and Properties
Overview

Basic Info.

Shape
Plate, Tube
Volum Resistivity
>10^(14)Ω .Cm
Size
Customized Size
Color
White
Thermal Shock Resistance
250 T( C)
Density
3.6g/cm3
Function
Welding Machine
Flexural Strength
345-358 MPa
Thermal Conductivity
25 W/M.K
Water Absorption
0
Material Composition
Alumina, Al2O3
Speciality
High Insulation
Type
Ceramic Plate
Transport Package
Carton Packing
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China

Product Description


Metallized Ceramic Componenets:
Innovacera supplies precision metallized ceramic parts in aluminum oxide ceramics for the aerospace industries. Through spray, needle, and brush coatings or screen printing our capabilities allow us to metallized on flat, cylindrical, and complex ceramic bodies. Moly-Manganese is the typical base coat materials used for metallization.In order to achieve the welding between ceramic and metal, the ceramic surface firmly adheres to a layer of the metal film, which is ceramic metallization.Refractory-metalized aluminum oxide ceramics widely use in power grid tubes, vacuum interrupters, and similar applications where metal to ceramic joints of exceptional strength and hermeticity is required.
 
Product Name
Metallized Ceramics Componenets ( Tube, Ring, Plate, Rod, Substrate . . . )
Material
95%, 96%, 99% Alumina (AL2O3)
Color
White+Metal
Coaing Layer
Mo/Mn
Coaing thickness
8-30um
Plated Layer
Ni,Cu,Au,Etc
Plating thickness
1-9um
Brade
INNOVACERA
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

Specification
>Metallization thickness: 25 ±10um
>Nickel thickness:2~10um;
>Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
Available Ceramic Composition >94%,96%,99%,99.6% Alumina Ceramic Components;
>AlN Ceramic Substrate;
>BeO Ceramic Substrate;
Special process
Metallization and Brazing are possible Our processing is available in a wide range of size and shapes as customer request.
Metallized Ceramic Components Joining types:
Ceramic + Mo/Mn Metallized + plating Ni
Ceramic + Mo/Mn Metallized + plating Ag
Ceramic + Mo/Mn Metallized + plating Au
Ceramic + Printing Ag
Special types are available according to customer's drawings or samples

 
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

Characteristics:

Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products
 
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

 

Material Properties:
Great mechanical strength Excellent wear resistance Low thermal expansion High operating temperatures Electrically insulating
Types of Metallization Ceramic Substrates

 

 
DBC (Direct Bonded Copper)
It is composed of ceramic substrate, bonding bonding layer and conductive layer. It refers to the special process of copper foil directly bonding to alumina or aluminum nitride ceramic substrate surface at high temperature.
 
Advantages: >The copper layer is thick; >The processing is fast; >The price is cheap; >Can make multilayer; >Suitable for large area consumption; >High thermal conductivity; >High adhesion strength; >Excellent soft brazing; >Excellent electrical insulation

 
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component


DPC (Direct Plated Copper)

Mainly by evaporation, magnetron sputtering and other surface deposition process to carry on the substrate surface metallization, first under the condition of vacuum sputtering, titanium, and then is copper particles, the plating thickness, then finish making line with ordinary PCB craft, and then to plating/electroless deposition way to increase the thickness of the line, the preparation of DPC way contains vacuum coating, wet deposition,Exposure development, etching and other processes.
 
Advantages: > In terms of shape processing, DPC ceramic plate needs to be cut by laser, the traditional drilling and milling machine and punch machine can not be accurately processed, so the combination force and line width is also more fine. > The crystal performance of the metal is good; > The flatness is good; > The line is not easy to fall off; > The line position is more accurate, the line distance is smaller, reliable and stable, can be through the hole and other advantages.

 
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

 

AMB(Active Metal Brazing)
It is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal.
 
Advantages: The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better
 
 
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

Thick film ceramic substrate

Thick film technology, it is straight on ceramic substrate printed graphics, then direct sintering process.
 
Advantages: > The bonding force with ceramic is much greater than that of the DPC process; > It is direct printing of graphics,no etching and copper plating process, so the cost will be lower; > It is one-time forming, so the flatness is smoother than that of the DPC.
 
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
Material Specification and Properties
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
 

ABOUT INNOVACERA
---

 

INNOVACERA is a professional high-tech enterprise, cooperate with Chinese University in advanced materials, many products are awarded as high-tech products and obtain patents.

 

Xiamen INNOVACERA engages in R&D, manufacturing and selling the products of advanced ceramic materials, including Alumina, Zirconia, Boron Nitride, Silicon Nitride, Machinable Glass Ceramic and other advanced materials. Through different manufacturing processes, we supply metallized ceramic components, alumina heater, ceramic pump components and other ceramic components as request.

 

Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

 

EXHIBITION
---
 
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

 

>>> Our Products are Alumina Ceramic, Zirconia Ceramic, Boron Nitride Ceramic,Porous Ceramic, Silicon Nitride Ceramic, Machinable Glass Ceramic, Beryllia Ceramic, Aluminum Nitride, Metallized Ceramic Components, Alumina Ceramic Heater, Ceramic Metering Pump And so on.
>>> Our aim is to offer ideal advanced material solution for any application.
>>> We delivery the order on time, competitive price, high quality and long service to our customers.
 
Mo Mn Alumina Al2O3 Dbc Dpc Amb Metallized Ceramic Substrate for Electronic Component

FAQ

 

Q1. Do you offer samples?
A: Yes, we'll offer you samples if we have stock, but some will charge sample fee. Shipping cost will pay by customer.

Q2. What is your terms of payment?
A: T/T in advance, Western Union, Alipay, Paypal.

Q3. How about your delivery time?
A: Depends on the requirement of the producst, according to the materials, dimensions and the manufacture process.

Q4. Do you test all your goods before delivery?
A: Yes, we have 100% test before delivery

Q5: What else products do you offer?
A: We provide the products of advanced ceramic materials, including Alumina, Zirconia, Boron Nitride, Silicon Nitride, Machinable Glass Ceramic and other advanced materials.

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier