• Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
  • Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
  • Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
  • Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
  • Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
  • Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au

Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au

Application: Aerospace, Electronics, Medical, Refractory, Industrial Ceramic
Material Composition: Alumina, Al2O3
Speciality: High Insulation, High Strength
Type: Ceramic Plates
Service Life: Long and Reliable
Line Definition: 0.1 mm
Manufacturer/Factory & Trading Company

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Fujian, China
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Basic Info.

Model NO.
DBC Ceramic Substrate
Cycling Times of Heating Load
>10000 Times
Thickness of Silver-Copper
0.015-0.15mm
Thickness of Ceramic Substrate
≥ 0.20 mm
Thermal Conductivity
≥ 170 W/M.K
Processing Service
Moulding, Active Metal Bonding
Transport Package
Vaccum&Carton Packaging
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China
Production Capacity
100000 Piece/Pieces Per Month

Product Description

Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au

 

 
Aluminum nitride ceramics have excellent electrical and thermal properties, and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metallized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include: thin film method, thick film method, high melting point metallization method, electroless plating method, direct copper cladding method (DBC), etc.
 
1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
Advantages of DBC ceramic substrate:
>high mechanical strength
>fine thermal conducticity
>excellent electrical isolation
>good adhesion
>corrosion resistant
>high reliability
>environmentally clean

Applications of DBC ceramic substrate:
1.power semiconductor modules
2.semiconductor refrig-erators
3.power control circuits
4.high frequency switch mode power suppliers
5.solid-state relays
6.Solar-panel arrays
7.telecommunications private branch exchange and receiving system industrial electronics
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
Aluminum Nitride Aln Metallized Dbc Substrate / Plate / Disc with Au
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