High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate

Product Details
Application: Aerospace, Electronics, Medical, Structure Ceramic
Compressive Strength: 3200
Flexural Strength: 480
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  • High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
  • High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
  • High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
  • High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
  • High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
  • High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
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Basic Info.

Model NO.
A Silicon Nitride Ceramic Substrate
Color
Black
Vickers Hardness
24
Water Absorption
0
Processing Service
Moulding
Max Working Temperature
1000ºC
Type
Ceramic Plates
Transport Package
Carton Packing
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China
Production Capacity
30000 Piece/Pieces Per Month

Product Description

Silicon Nitride Si3N4 Ceramic Plate:
Silicon Nitride (Si3N4) is 60% lighter than steel but strong enough to survive some of the most demanding
applications in a variety of industries. This lightweight, high-strength ceramic material is used as an
alternative to stainless steel, super alloys, tungsten carbides and first-generation ceramics such as Al2O3
and ZrO2. It offers excellent thermal shock resistance and high fracture toughness, compatibility with
nonferrous metal melts, and improved structural reliability compared to other ceramic materials.
 
Silicon Nitride (Si3N4) Characteristics:
>Good thermal shock resistance
>Creep resistance
>Low density
>High fracture toughness
>High hardness and wear resistance
>Electrical resistivity

Product Features:
.Very low density
.High wear resistance and corrosion resistance
.High temperature resistance
.Good flexural strength and high fracture toughness
.Very good thermal shock resistance
.Dimensional stability and aging resistance
.Excellent sliding properties (tribology)
.Biocompatibility (for use in hygiene and the food and .beverage industry)
High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
 
High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
Typical Silicon Nitride Uses:
 
. Rotating bearing balls and rollers
. Cutting tools .Engine moving parts - valves, turbocharger rotors
. Engine wear parts - cam followers, tappet shims
. Turbine blades, vanes, buckets
. Metal tube forming rolls and dies
. Precision shafts and axles in high wear environments
. Weld positioners

 
Silicon Nitride Ceramic 4 Types:
* Reaction-Bonded Silicon Nitride (RBSN)
* Hot Pressed Silicon Nitride (HPSN)
* Sintered Reaction-Bonded Silicon Nitride (SRBSN)
* Sintered Silicon Nitride (SNN)
 
Silicon Nitride Properties
Properties
Units
Silicon Nitride (Si3N4)
HPSi3N4
GPSi3N4
Mechanical
Density
g/cm3
3.24~3.28
3.24~3.26
Color
--
Gray
Gray
Water Absorption
%
0
0
Vickers Hardness
Gpa
14
14
Flexural Strength(20°C)
Mpa
850-900
750-800
Compressive Strength(20°C)
Mpa
3000
3000
Thermal
Thermal Conductivity(20°C)
W/m.K
42
22
Thermal Shock Resistance(20°C)
Δ T(C)
617
605
Maximum Use Temperature
°C
1500
1500
Electrical
Volume Resistivity(25°C)
Ω.cm
--
--
 
High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
High Thermal Conductivity Silicon Nitride Thin-Film Ceramic Substrate
 
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