Aluminum Oxide Ceramic Structural Parts 95 99 Alumina Ceramic Substrate / Sheet / Plate / Board

• Application: Industrial Applications
• Function: Thermal Insulation and Sound Insulation
• Material: Porcelain Ceramic Plate
• Model NO.: ZD INCA654
• Process: Porcelain Ceramic Plate
• Color: White/Ivory
• Water Absorption: 0
• Thermal Conductivity: 16.7-35W/M.K
• Processing Service: Moulding
• Density: 3.6-3.95g/cm3
• Compressive Strength: 550-3000MPa
• Volume Resistivity: >10 14
• Max Using Temperature: 1500-1700
• Ceramic Flexural Strength: 345-380MPa
• Vickers Hardness: 11-14gpa
• Purity: 95%
• Type: Ceramic Plates
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

 

Alumina ceramic substrates now are widely used in the automotive industry, especially the large ceramic substrate. Innovacera are specializing in alumina ceramic substrates, the max size of AL2O3 ceramic substrates Innovacera made is 380*200*1 mm (0.8 mm and 0.635 mm thickness are also available). The substrates are part of a specific brazing process, used as spacers during thermal treatment.

 

The Aluminum oxide (Al2o3 ) ceramic sheet is widely used in thick-film circuit of electronics industry. Large scale
integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer
etc.According to the demands of customers,our company can manufacture products of special types and specifications.

 

Alumina ceramic substrate / plate specification:

> 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc.

> The thickness of ceramic plate ranges from 0.25 to 1.0mm
Can be made according to your requirements

 

Why Polish Ceramic Substrates?

Alumina Oxide is one of the most cost-effective and widely used substrate materials in microelectronic applications. While many customers will be satisfied with an as-fired surface for their applications, there are four major benefits of ceramic substrate polishing:

 

1. Finer Line Patterns:
After the fine grinding and polishing process, the ceramic substrate can get finer pattern lines, which is beneficial to the
denser circuit design ability and is conducive to fine-pitch, high-density interconnection circuits.
An as-fired surface finish is generally adequate for lines as thin as 1 mil in thin-film applications and 5 mils in thick-film
applications. Forming finer lines than these on as-fired surfaces will exhibit poor pattern definition resulting in increased
conductor resistance, which inhibits current flow and reduces circuit performance. Poor pattern definition can also contribute to performance anomalies in RF and microwave circuits, so we will polish it.

2. Better Top and Bottom Surface Parallelism:
Grinding and polishing the substrate can improves the parallelism between the top and bottom surfaces. The benefit is that the capacitance and inductance of the substrate can be more tightly controlled when the substrate is metalized and patterned. Since capacitance and inductance are the main factors determining impedance, increased parallelism can improve the predictability and performance of RF and microwave circuits.

 

 

 

 

Advantage:

1.Purity:92%, 95%, 96%, 99%, 99.7%

2.Good mechanical strength

3.Excellent electrical insulation

4.High-frequency loss

5.Good thermal conductivity

6.Heat, wear and corrosion resistance.

.

 

Application:

Alumina is the best-known advantaced ceramic material is widely used in 

1.Automotive

2.Petro-chemical 

3.Fluid control

4.Material transfer

5.Industry

6.Electrical and electronic

7.Semiconductor

8.Sapphire is single-crystal alumina

 

Alumina Ceramic Property
Property			Unit	92% Alumina Ceramic	95% Alumina Ceramic	99% Alumina Ceramic
Density			g/cm3	≥3.63	≥3.68	≥3.83
Water absorption			%	O	O	O
Sintering temperature			°C	1500-1700	1600-1800	1700-1800
Hardness			HV	≥1400	≥1500	≥1650
Flexural strength			Kgf/cm2	3000	3000	3000
Compressive strength			Kgf/cm2	24000	25000	26000
Fracture toughness			Map.m3/2	3~4	3~4	4~5
Maximum temperature			°C	1600	1700	1800
Coefficient of thermal expansion			/°C	8*10-6	8*10-6	8*10-6
Heat shock			T(°C)	220	220	220
Thermal conductivity			W/m.k(25-300°C)	25 14	25 14	25 14
	20°C		>1012	>1012	>1012