Hermetic Optoelectronic Packaging Solutions

• Application: Aerospace, Medical
• Speciality: High Insulation, High Strength, Temperature Resistant
• Type: Ceramic Part
• Typical to-Style Package Package Model: to-254 / to-257
• Plating Structure: Ni+Au
• Heat Sink Material: Wcu
• Lead Material: Copper-Cored Kovar / Copper
• Lead Diameter: 1.0mm / 0.8mm /
• Max. Current Capacity: 20A Max / 15A Max / 60A Max / 45A Max
• Transport Package: Carton Package
• Specification: Customized
• Trademark: INNOVACERA
• Origin: China

Product Description

Ceramic Packages For Semiconductor Discrete Device Power Electronics

Ceramic Packages For Semiconductor Discrete Device Power Electronics Innovacera develops ceramic packages and metal packaging shells to meet customer customized requirements. Innovacera's factory has established robust capabilities in the research and development of ceramic and glass materials, tape casting for green ceramics, microwave/RF simulation, packaging technologies including the ceramic packaging shells/substrates, brazing/sealing, and surface treatment processes, offering customers comprehensive and integrated packaging solutions.

Innovacera offers ceramic packages for semiconductor discrete device power electronics by using ceramic-to-metal sealing technologies. Ceramic packages adopt a ceramic sidewall structure instead of the traditional bead-type insulated ceramic design,significantly improving the voltage withstand performance of the housing. Copper-cored kovar lead pins and WCu heat sinks are bonded onto multilayer alumina ceramic packages or aluminium nitride ceramic packages. It is primarily used for encapsulating high-power transistors, diodes, triodes, and power modules.

Ceramic Packages Current Carrying Capacity:
Typical TO-Style Package
Package Model	TO-254	TO-257
Plating Structure	Ni+Au	Ni+Au
Heat Sink Material	WCu	WCu
Ceramic Size (mm)	9.6×9.6	7.5×6.0
Lead Diameter	Lead Material	Max. Current Capacity
1.0mm	Copper-cored Kovar	20A max
0.8mm	Copper-cored Kovar	15A max
1.0mm	Copper	60A max
0.8mm	Copper	45A max

Ceramic Packages Features:

Ceramic Packages Features: Heat Sink Materials: WCu, CPC, CMC, etc.

Lead Materials: Copper-cored Kovar, copper.

Insulation Resistance: 1010Ω(500V)

Withstand Voltage: > 1000V.

Leak Rate: ≤1×10³Pa ·cm³/s

Plating Options: Full nickel plating, full Ni/Au plating.

Sealing Method: Parallel seam welding.

Temperature Cycling: -65℃~+175℃, 500 cycles.