• Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
  • Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
  • Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
  • Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
  • Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
  • Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity

Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity

Application: Aerospace, Electronics, Medical, Refractory, IGBT, Power Module, Heat-Sink
Type: Substrate, Tubes, Rod
Flexural Strength: 450MPa
Advantage: Heat, Wear and Corrosion Resistance
Color: Grey
Dielectric Constant: 8-10 (1MHz)
Manufacturer/Factory & Trading Company

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Fujian, China
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Overview

Basic Info.

Thermal Conductivity
>170W/M.K
Thermal Expansivity
2-3
Processing Service
Moulding
Density
>3.33G/Cm3
Transport Package
Carton Packing
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China

Product Description

Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity

 

 
 
Aluminum Nitride is stable at very high temperatures in inert atmospheres. Also, it is the only technical ceramic material that offers high thermal conductivity and good electrical insulation. So it is widely used for electronics and thermal management relevent applications.
Key Properties & Popular Application
Key Properties
 
Applications
~High Thermal Stability
 
 
~Low Thermal Expansion
 
 
~High Thermal Conducivity 
 
 
~High Thermal Shock Resistance
High thermal conductivity makes AlN ideal for applications where fast and uniform thermal response is required It is often used for electronics applications due to its excellent heat dissipation properties.
 
Also, the high thermal conductivity coupled with low thermal expansion make AIN an excellent thermal shock resistant material which withstands rapid heating and cooling
*Heat sinks & heat spreaders
 
*Semiconductor heaters 
 
*Substrate material for high power, electronic devices 
 
*Heat transfer components
used at high temperatures 
 
*Laser heatsinks power rectifiers
Available size and Machining Capobility
Availability 
Sizes (mm)
Machining Capability
Sizes (mm)
Plate
350 x 30
Hole Diameter
0.03 or more
Rod
100 x 200
Hole depth
300 or less
Groove width
0.05 or more
Max. hole number
3000 (approx)
Max.step height
30
Thread size
Mz or more
Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
Properties
 
 
 
 
Properties
Unit
INC-AN180
INC-AN200
INC-AN220
Color
 
Gray
Gray
Beige
Density
g/cm3)
3.3
3.3
3.28
Thermal conducitivity
(W/m.K)
in 20°C
180
200
220
Bending strength
(Mpa
>=350
>=325
>=280
Insulation
(KV/mm)
31
27
27
Dielectric
 
9
8.8
8.6
CTE (10-6)
 
4.8
4.6
4.5
Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
Product Classification
Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
Company Profile
Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
Why Choose Us
Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
Product packaging
Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
Browse More Products
Aluminum Nitride Ceramic Tubes Aln Structural Component with High Thermal Conductivity
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