| Application: | Aerospace, Electronics, Medical, Refractory |
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| Technology: | Dbc/ Dpc |
| Size: | Customized Size |
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DBC ceramic substrates
DBC (Direct Bond Copper) Substrate are used a special process in which the copper foil and the Al2O3 or ALN (one or both sides) are directly bonded under appropriate high temperature, which applications are power semiconductor modules, thermoelectric cooling modules, electronic heating devices, power control circuits,power hybrid circuit. |
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Benefits:
High mechanical strength,mechanically stable shape.
Better thermal cycling capabilities,high reliability. Environmentally friendly. |
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