High Thermal Conductivity Aln Aluminum Nitride Ring / Gasket / Washer

• Application: Aerospace, Medical, Industrial Ceramic
• Color: Gray, Light Grey
• Material: Aluminum Nitride Ring
• Model NO.: Aluminum Nitride Ceramic Ring
• Volume Resistivity: 1.4*10(14) Ω.Cm
• Flexural Strength: 450MPa
• Dielectric Strength: 18.45 Kv/mm
• Dielectric Constant: 8.56 (1MHz)
• Surface Roughness: 0.3-0.5
• Thermal Conductivity: (25°c) 180 W/Mk
• Processing Service: Moulding
• Density: 3.31g/cm3
• Type: Ceramic Ring
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

 

Aluminum Nitride Ceramic Ring
The aluminum nitride (AlN) ceramic has high thermal conductivity (5-10 times as the alumina ceramic), low
dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, 
high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is 
widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests.

Product Performance: 
- High thermal conductivity, high flexural strength, high temperature 
- Good electrical insulation 
- Low dielectric constant and loss 
 - Able to be laser drilled, metallized, plated and brazed

Product Features:
1.Uniform microstructure
2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives
3.High electrical resistivity
4.Thermal expansion coefficient close to that of Silicon
5.Resistance to corrosion and erosion
6.Excellent thermal shock resistance
7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation
    occurs around 780°C; the surface layer protects the bulk up to 1380°C).
 

 

 

 

 

 

 

 

Aluminium Nitride Material Properties
Material		ALN
Item No.		INC-AN180	INC-AN200	INC-AN220
Color		Gray	Gray	Beige
Main Content		96%ALN	96%ALN	97%ALN
Main Characteristics		High Thermal Conductivity,Excellent Plasma Resistance
Main Applications		Heat Dissipating Parts,Plasma Resistance Parts
Bulk Density		3.30	3.30	3.28
Water Absorption		0	0	0
Vickers Hardness(Load 500g)		10.0	9.5	9.
Flexural Strength		>=350	>=325	>=280
Compressive Strength		2500	2500	-
Young' Modulus of Elasticity		320	320	320
Poisson's Ratio		0.24	0.24	0.24
Fracture Toughness		-	-	-
Coefficient Linear Thermal Expansion	40-400degree	4.8	4.6	4.5
Thermal Conductivity	20degree	180	200	220
Specific Heat		0.74	0.74	0.76
Thermal Shocking Resistance		-	-	-
Volume Resistivity	20degree	>=10-14	>=10-14	>=10-13
Dielectric Strength		>=15	>=15	>=15
Dielectric Constant	1MHz	9	8.8	8.6
Loss Tangent	*10-4	5	5	6