Electrical Insulation Thermal Conductivity Aln Aluminum Nitride Ceramic Substrate Sheet Disc Chip

• Application: Aerospace, Electronics, Medical, Refractory, Industrial Ceramic
• Type: Ceramic Plates
• Color: White,Ivory,Yellow,etc
• Work Temp.: 1400 °c to 1900 °c
• Metallization Thickness: 25+/-10um
• Processing Service: Moulding
• Plating Thickness: 2-10um
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

 

 

Product Name: Aluminum Nitride Ceramic Substrate, AlN Ceramic Sheet

 

Application: Often used in electrical and electronic fields requiring heat conduction, heat dissipation, insulation, high temperature resistance,high voltage breakdown resistance, high thermal conductivity, good stability.

 

Product specifications: Conventional models are TO-220, 247, 264, 3P

 

Range thickness: 0.25mm, 0.385mm, 0.5mm, 0.635mm, 0.8mm, 1mm, 1.5mm, 2mm, 3mm

 

Product Advantages: Aluminum nitride ceramics have excellent thermal conductivity (7-10 times of alumina ceramics), low dielectric constant and dielectric loss, reliable insulation performance, excellent mechanical properties, non-toxic, high temperature resistance, chemical corrosion resistance, and the thermal expansion coefficient of silicon is similar, as a new generation of ceramic materials, more and more by people Attention and attention. Aluminum nitride ceramics produced by our company lead the quality of similar domestic products, with the international advanced level, widely used in communication devices, high brightness LED, power electronic devices and other industries.

 

 

Ceramic substrate size specification and precision standard

 

Thickness d: minimum 0.2mm and maximum 1.2mm
Maximum length L: 380mm
Maximum width W: 200mm
Minimum aperture Φ: 0.15mm
Minimum distance from hole or line to edge :1mm
Minimum distance between holes: 1mm

 

 

Application

 

 

 

 

 

- RF / Microwave Components

- Power Modulus

- Power Transformers

- High Power LED Package

 

 

 

 

- Laser Diode Sub-mounts

- LED Chip Sub-mount

- Microelectronic Packages

- Transistors

 

 

 

 

- High Thermal Conductivity Substrates

 

for LED & Power Electronics

 

- Substrates for Power Electronics

 

Aluminium Nitride Material Properties
Material			ALN
Item No.			INC-AN180	INC-AN200	INC-AN220
Color			Gray	Gray	Beige
Main Content			96%ALN	96%ALN	97%ALN
Main Characteristics			High Thermal Conductivity,Excellent Plasma Resistance
Main Applications			Heat Dissipating Parts,Plasma Resistance Parts
Bulk Density			3.30	3.30	3.28
Water Absorption			0	0	0
Vickers Hardness(Load 500g)			10.0	9.5	9.
Flexural Strength			>=350	>=325	>=280
Compressive Strength			2500	2500	-
Young' Modulus of Elasticity			320	320	320
Poisson's Ratio			0.24	0.24	0.24
Fracture Toughness			-	-	-
Coefficient Linear Thermal Expansion	40-400degree	4.8	4.6	4.5
Thermal Conductivity	20degree	180	200	220
Specific Heat			0.74	0.74	0.76
Thermal Shocking Resistance			-	-	-
Volume Resistivity	20degree	>=10-14	>=10-14	>=10-13
Dielectric Strength			>=15	>=15	>=15
Dielectric Constant	1MHz	9	8.8	8.6
Loss Tangent	*10-4	5	5	6

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