Aluminum Nitride Active Metal Brazed (AMB) Ceramic Substrate / Structural Parts

• Application: Catalytic Converter, Refractory Lining, Thermal Insulation
• Material: Alumi
• Color: Dark Gray
• Model NO.: DBC Ceramic Substrate
• Chemical Durability(Mg/Cm2): 0.97
• Dielectric Constant(1MHz): 8.56
• Flexural Strength(MPa): 382.7
• Volume Resistivity(Ω .Cm): 1.4*1014
• Processing Service: Moulding, Active Metal Bonding
• Camber(Length ‰ ): <=2‰
• Surface Roughness Ra(μm): 0.3-0.5
• Bulk Density(g/cm3): 3.335
• Dielectric Strength(Kv/mm): 18.45
• Thermal Conductivity: ≥ 170 W/M.K
• Type: Ceramic Plates
• Transport Package: Vaccum&Carton Packaging
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 100000 Piece/Pieces Per Month

Product Description

AMB (Active Metal Brazing) is for joining ceramics that are not wetted by 'conventional' brazes.
By applying active metal like titanium to be added to the braze alloy, to achieve chemically reacts with the surface of the parent ceramic.Due to the coefficient of thermal expansion of Al2O3 (7.1 ppm/K), Si3N4 (2.6 ppm/K) and AlN (4.7 ppm/K) is close to that of silicon (4 ppm/K), Direct Bond Copper (DBC) and AMB are suitable substrates for robust packaging of bare dice since such assemblies.
AMB is the promising thick film technology which can be applied to Power Electronics, Automotive Electronics, Home Appliances, Aerospace, Others.

INNOVACERA provide DBC, DPC, and AMB technology for customized ceramic substrates, welcome to consult more.

Despite the various machining methods available for aluminum nitride ceramics, precision machining often necessitates the use of CNC equipment. However, the formidable hardness of aluminum nitride, exceeding 11 GPa, renders conventional metal machining techniques ineffective.

 

 

Firstly, machining aluminum nitride ceramics requires specialized tools and techniques distinct from those used for metals. Common tool materials such as tungsten steel should be avoided to prevent rapid deterioration of tool life. Instead, polycrystalline diamond (PCD) tools are preferred for grinding operations due to their diamond composition, enabling effective machining of aluminum nitride materials.

 

Equally crucial is the establishment of rational machining paths, which significantly influence machining outcomes. During CNC machining of aluminum nitride ceramics, issues like edge collapse after piercing frequently arise. Implementing appropriate machining paths can preempt such occurrences, thereby enhancing the quality of aluminum nitride ceramic products.

 

Secondly, equipment selection plays a pivotal role due to the hardness of aluminum nitride ceramics. Conventional CNC machine tools often lack the requisite rigidity to effectively machine these materials. Given the extreme hardness of aluminum nitride, machining inevitably induces greater vibrations than other materials. Insufficient rigidity may lead to tool chatter and jeopardize spindle accuracy. For optimal machining of aluminum nitride ceramics, dedicated ceramic machining centers with enhanced rigidity are recommended. These specialized machines mitigate vibration during machining, thereby safeguarding spindle integrity and offering superior protection against abrasive ceramic powders.
 

Aluminium Nitride Material Properties
Material		ALN
Item No.		INC-AN180	INC-AN200	INC-AN220
Color		Gray	Gray	Beige
Main Content		96%ALN	96%ALN	97%ALN
Main Characteristics		High Thermal Conductivity,Excellent Plasma Resistance
Main Applications		Heat Dissipating Parts,Plasma Resistance Parts
Bulk Density		3.30	3.30	3.28
Water Absorption		0	0	0
Vickers Hardness(Load 500g)		10.0	9.5	9.
Flexural Strength		>=350	>=325	>=280
Compressive Strength		2500	2500	-
Young' Modulus of Elasticity		320	320	320
Poisson's Ratio		0.24	0.24	0.24
Fracture Toughness		-	-	-
Coefficient Linear Thermal Expansion	40-400degree	4.8	4.6	4.5
Thermal Conductivity	20degree	180	200	220
Specific Heat		0.74	0.74	0.76
Thermal Shocking Resistance		-	-	-
Volume Resistivity	20degree	>=10-14	>=10-14	>=10-13
Dielectric Strength		>=15	>=15	>=15
Dielectric Constant	1MHz	9	8.8	8.6
Loss Tangent	*10-4	5	5	6