• 0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
  • 0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
  • 0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
  • 0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
  • 0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
  • 0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate

0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate

Application: Aerospace, Electronics, Medical, Industrial Ceramic
Purity: 95%-99%
Type: Ceramic Plates
Color: White
Compressive Strength: 2100-2500MPa
Working Temperature: 1700 Degree
Manufacturer/Factory & Trading Company

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Fujian, China
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Basic Info.

Model NO.
Ceramic Substrate
Processing Service
Cutting, Punching, Moulding
Density
3.8GM/Cc
Feature
Heat Resistance
Flexural Strength
280-350 MPa
Product Name
Alumina Ceramic Substrate
Thermal Conductivity
25-30 W/Mk
Certificate
RoHS
Transport Package
Customized Package
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China
Production Capacity
10000 Piece/Pieces Per Month

Product Description

0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
 

The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. The Maximum dimension of ceramic plate is 138x138mm and the thickness of ceramic plate ranges from 0.25 to 1.0mm. Alumina Ceramic Substrate Features: > High reliablility and sfety; > High density and mechanical properties > High electrical and thermal loading perormances > Low dilelectic loss and other characteristics
 
Alumina ceramic substrate / plate specification:
10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc.
Can be made according to your requirements.
 
0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate

 

Main Technical Specifications of Al2o3 (96%) Ceramic Substrate
Material property
 
Units
96% Al2o3
Color
 
\
White
Medium Grain Size
 
µm
3-5
Surface roughness
 
µm
0.6max
Density
 
/m3
3780
Rate of water absorption
 
%
0
Bending strength 4 point method  (40 x 4 x3mm3)
 
Mpa
400
Dual ring method (0.63mm substrate thickness)
 
Mpa
500
Modulus of Yang
 
Gpa
340
Thermal conductivity (20-100)
 
W / M.K
24
Specific heat
 
j/kg.k
800
 
Coefficient of Linear expansion
20-300
10-6/k
6.8
 
20-600
 
7.3
 
20-1000
 
8
Dielectric constant
1 MHz
 
9.8±10%
 
1 GHz
 
10.0±10%
Dielectric loss factor ( 1 MHz )
 
10-3
0.3
 
Breakdown Voltage 1mm substrate thickness
1mm
kv/mm
15
 
0.63mm
 
20
 
0.25mm
 
28
 
 
Volume resistivity
20
.cm
1013
 
200
 
1012
 
400
 
1011
 
600
 
108

 

Alumina Ceramic Substrate Laser Cutting Processing Our company has been equipped with high precision laser cutting processing installations. The lasers are used for scribing,cutting and drilling substrates ( Minimum hole diameter:0.1mm ;Minimum hole spacing betwwen holes:0.2mm; circular accuracy:0.05mm;width of cutting seam:0.1~0.15mm; Depth of cutting seam:30% ~ 50% of thickness of ceramic substrates;thermal trsnsmissiong region:0.025mm).It has high cutting accuracy,very small tolerance,eliminating the time -consuming and costly tool fabrication stage,as well as increasing the goods supply efficiency by s big margin and shortening the processing circle. Laser cutting method allows to produce substrates with various outside contour geometries, hole patterns,cut-outs and snap-lines. Laser-scribed multiple substrates can be supplied in all common machine formats from 2 inch x 2 inch to 5.4inch x 7.4 inch ,the thicknesses of processing usbstrates are 0.25,0.38,0.5,0.63,0.76,1.0mm.
 
PRODUCT DETAILS
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0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
 
Alumina Ceramic Property
 
 
 
 
 
 
Property
 
Unit
92% Alumina Ceramic
95% Alumina Ceramic
99% Alumina Ceramic
Density
 
g/cm3
≥3.63
≥3.68
≥3.83
Water absorption
 
%
O
O
O
Sintering temperature
 
°C
1500-1700
1600-1800
1700-1800
Hardness
 
HV
≥1400
≥1500
≥1650
Flexural strength
 
Kgf/cm2
3000
3000
3000
Compressive strength
 
Kgf/cm2
24000
25000
26000
Fracture toughness
 
Map.m3/2
3~4
3~4
4~5
Maximum temperature
 
°C
1600
1700
1800
Coefficient of thermal expansion
 
/°C
8*10-6
8*10-6
8*10-6
Heat shock
 
T(°C)
220
220
220
Thermal conductivity
 
W/m.k(25-300°C)
25 14
25 14
25 14
 
20°C
 
>1012
>1012
>1012
0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate

 

 
RFQ
 
1.What's the max using temperature ?
Max 1700degree

2.Which composition suitable for metallized ceramics?
95% alumina

3.What's the 99 alumina's major applications?
Pump Shaft,Drive Shaft,Sealing Ring

4.Can you do OEM?
We are mostly doing by drawing

5.What's the delivery time?
About 35days
0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate
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