The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices

Product Details
Application: Aerospace, Electronics, Medical, Refractory
Material Composition: Alumina, Al2O3
Speciality: High Insulation
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  • The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices
  • The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices
  • The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices
  • The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices
  • The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices
  • The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices
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Basic Info.

Type
Ceramic Part
Treatment
Glazed, Polishing
Color
White+Metal
Coating Thickness
8-30μm
Plated Layer
Nickel/Copper/Gold
Processing Service
Welding, Moulding
Plating Thickness
2-9μm
Max. Use Temperature
1600ºC
Transport Package
Carton Packing
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China

Product Description

 

INNOVACERA Alumina Ceramic to Metal Seal Vacuum Feedthrough For High Pressure Brazing

The Molybdenum/Manganese metallization developed the technology on Ceramic-to-metal brazed assembly, it provides high mechanical strength and good electrical insulation. At the very beginning, it's used in vacuum electronic devices, gradually applied to semiconductors, integrated circuits, electric light sources, high-energy physics, aerospace, chemical industry, metallurgy, instrumentation and machinery manufacturing and other industrial fields.

So how to choose a material become more and more critical for a good vacuum brazing. Here we're mainly discussing about 3 different types of materials that will be used for ceramic-to-metal.
 

 
Material
Alumina/BeO/AlN
Coating Layer
Mo/Mn
Thickness:8-30μm
Plated Layer
Nickel, Copper, Gold, etc. 
Thickness: 2-9μm
Treatment
Glazed, polishing
Dimension
Customized
Joining types
Ceramic + Mo/Mn Metallized + plating Ni
Ceramic + Mo/Mn Metallized + plating Ag
Ceramic + Mo/Mn Metallized + plating Au
Ceramic + printing Ag
 
The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices

1. Ceramic
* Al2O3 * BeO * BN * AlN

2. Metala
* Kovar alloy * OFC * Stainless steel

* Mild steel

3. Solder
* Ag * Ag-Cu * Cu * AU-Cu * Au-Ni
 
 
The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices
The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices
The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices

The Ceramic materials are required to be high-temperature stabilized and good thermal expansion of coefficient, INNOVACERA apply mostly the Al2O3. Since ceramics will not be directly wetted, which impedes the adherence of molten metal layers and adhesives, added that the different coefficients of thermal expansion (CTE) between Ceramic and Metal. Breakthrough on such difficulties is with a soldering or brazing process.
 
Metal layer applied on ceramic components via Mo/Mn metallization and Plating or Active brazing, after that, the ceramic and metal components are joined by the melting and subsequent solidification of a filler metal-Solder, with different solders for different applications in different working temperatures.

The Molybdenum/Manganese Metallization Breakthrough on Technology of Ceramic to Metal Brazed Used in Vacuum Electronic Devices

 
Alumina Ceramic Properties
Properties
Units
Alumina Ceramic
Purity
wt%
95%
99%
99.8%
Volume Density
g/cm3
3.65
3.8
≥3.89
Water Absorption
%
0
0
0
Crystal Size(Grain Size)
μm
4-5
4-5
4-5
Vickers Hardness, HV1.0
Gpa
14
1600
≥15
Flexural Strength
Mpa
300
310
≥300
Coefficient of Linear
Expansion
20-500ºC
1x10-6 mm/ºC
6.5-7.5
6.5-7.5
6.5~7.5
20-800ºC
6.5-8.0
6.5-8.0
6.5~8.0
Thermal Conductivity
W/m·K( 20ºC)
20
25
≥20.9
Specific Heat Capacity
KJ/(kg·K)
≥0.8
≥0.8
≥0.8
Dielectric Strength
KV/mm
≥12
15*106
≥12
Volume Resistivity
Ω·cm 20ºC
≥1014
≥1014
≥1014
Ω·cm 300ºC
≥1011
≥1011
≥1011
Ω·cm 500ºC
≥109
≥109
≥109
Dielectric Constant
1MHz
9
9-10
9-10
Tangent of Dielectric Loss
1MHz
≤4x10-4
≤2x10-4
≤3x10-4
Surface Roughness
μm
0.4 After Machine
0.1-0.4 After Machine
0.1-0.4 After Machine
Max Working Temperature
ºC
1600
1600
1650


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