• Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
  • Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
  • Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
  • Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
  • Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
  • Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates

Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates

Application: Aerospace, Electronics, Medical, Refractory
Material Composition: Alumina, Al2O3
Speciality: High Insulation, High Strength
Type: Ceramic Plate
Compressive Strength: 2300MPa
Coating Thickness: 8-30μm
Manufacturer/Factory & Trading Company

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Fujian, China
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Basic Info.

Model NO.
A DBC Substrate
Coating Layer
Mo/Mn
Plated Layer
Nickel/Copper/Gold
Thermal Conductivity
25W/(M.K)
Processing Service
Moulding
Density
3.7g/cm3
Plating Thickness
2-9μm
Max. Use Temperature
1600ºC
Transport Package
Standard Cartons with Foam
Trademark
INNOVACERA
Origin
Fujian, China
Production Capacity
10000 Piece/Pieces Per Month

Product Description

Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates

 

DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just like PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century.
 
DBC Substrate Features:
1.High mechanical strength,mechanically stable shape;high strength,fine thermal conductivity,excellent electrical
isolation;good adhesion,corrosion resistant;
2.Much better thermal cycling capabilities (up to 50000 cycles),high reliability;
3.May be structured just like PCB boards or IMS substrates to get etched wiring;
4.No contamination,environmentally clean;
5.Wide application temperature:-55 ~ 850; The thermal expansion coefficient is closed to that of silicon, so production technologies of power module are greatly simplified. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer's drawings or samples


 
Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates


Properties

 
Properties
Unit
Test Method
Material
IN94
IN96
IN99
Mechanical
Color
-
-
White
White
Ivory
Alumina Content
%
-
94
96
99
Bulk Density
g/cm3
ASTM C-20-83
3.70
3.80
3.90
Surface Roughness
Um
Profilometer
-
Max 0.6
-
Water Absorption
%
ASTM C373-72
0.0
0.0
0.0
Average Crystalline Size
Um
ASTM E112-88
4
3
4
Flexural Strength (20°C)
MPa
ASTM F417-78
350
370
370
Elastic Modulus
Gpa
ASTM C773-82
290
310
340
Poisson's Ratio
-
ASTM C773-82
0.22
0.22
0.22
Compressive Strength
Mpa
ASTM C773-82
2100
-
2500
Hardness
-
Knoop 1KG
12
-
14
Fracture Toughness
Mpa.m1/2
NOCHED BEAM
3.4
-
4.5
Thermal
Thermal Conductivity (20°C)
W/m.K
ASTM C408-82
21
24
28
Coefficient of Thermal Expansion(20~1000°C)
×10-6/°C
ASTM C372-81
8.0
7.8
8.1
Specific Heat
Cal/g°C
ASTM C351-82
0.2
0.2
0.2
Thermal Shock Resistance
°C
Customer
200
200
200
Max. Use Temperature
°C
-
1600
1600
1650
Electrical
Dielectric Strength
KV/mm
ASTM D116-76
≥12
≥15
≥17
Dielectric Constance (1MHz.25°C)
-
ASTM D150-81
9.2
9.6
9.7
Dielectric Loss (tan delta, 1MHz.25°C)
-
ASTM D150-81
0.0004
0.0003
0.0002
Volume Resistivity (25°C)
Ωcm2/cm
ASTM D1829-68
≥10 14
≥10 14
≥10 14

 
 
Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
Innovacera Alumina Al2O3 Ceramic Metallized Dbc Ceramic Substrates
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