High Temperature Aluminum Nitride Ceramic Wafer for Automobile

Product Details
Application: Aerospace, Electronics, Medical, Refractory
Type: Ceramic Plates
Mechanical Strength: 450MPa
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  • High Temperature Aluminum Nitride Ceramic Wafer for Automobile
  • High Temperature Aluminum Nitride Ceramic Wafer for Automobile
  • High Temperature Aluminum Nitride Ceramic Wafer for Automobile
  • High Temperature Aluminum Nitride Ceramic Wafer for Automobile
  • High Temperature Aluminum Nitride Ceramic Wafer for Automobile
  • High Temperature Aluminum Nitride Ceramic Wafer for Automobile
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Basic Info.

Model NO.
Aluminum Nitride Ceramic Disc
Size
Customized
Color
Gray
Surface Roughness
0.3-0.5
Thermal Conductivity
More Than 170W/Mk
Processing Service
Welding, Cutting, Moulding
Transport Package
Carton Packing
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China

Product Description

The Aluminum Nitride(AlN) ceramic has high thermal coductivity(5-10 times as the Alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance, and the linear expansion cofficient is similar with Si, which is widely used in communication compents, high power led, power electronic devices and other fields. Special spec products can be produced upon requests.

1. High thermal conductivity, high flexural strength, high temperature
2. Good electrical insulation
3. Low dielectric constant and loss
4. Able to be laser drilled, metallized, plated and brazed
 

1. RF/Microwave components

2. Power modulus
3. Power transformers
4. High power LED package
5. Laser diode sub-mounts
6. LED chip sub-mount
7. Microelectronic packages
8. Transistors

 
High Temperature Aluminum Nitride Ceramic Wafer for Automobile
High Temperature Aluminum Nitride Ceramic Wafer for Automobile
 
High Temperature Aluminum Nitride Ceramic Wafer for Automobile
High Temperature Aluminum Nitride Ceramic Wafer for Automobile

 
Aluminium Nitride Material Properties
Material
ALN
Item No.
INC-AN180
INC-AN200
INC-AN220
Color
Gray
Gray
Beige
Main Content
96%ALN
96%ALN
97%ALN
Main Characteristics
High Thermal Conductivity,Excellent Plasma Resistance
Main Applications
Heat Dissipating Parts,Plasma Resistance Parts
Bulk Density
3.30
3.30
3.28
Water Absorption
0
0
0
Vickers Hardness(Load 500g)
10.0
9.5
9.
Flexural Strength
>=350
>=325
>=280
Compressive Strength
2500
2500
-
Young' Modulus of Elasticity
320
320
320
Poisson's Ratio
0.24
0.24
0.24
Fracture Toughness
-
-
-
Coefficient Linear Thermal Expansion
40-400degree
4.8
4.6
4.5
Thermal Conductivity
20degree
180
200
220
Specific Heat
0.74
0.74
0.76
Thermal Shocking Resistance
-
-
-
Volume Resistivity
20degree
>=10-14
>=10-14
>=10-13
Dielectric Strength
>=15
>=15
>=15
Dielectric Constant
1MHz
9
8.8
8.6
Loss Tangent
*10-4
5
5
6

High Temperature Aluminum Nitride Ceramic Wafer for AutomobileHigh Temperature Aluminum Nitride Ceramic Wafer for AutomobileHigh Temperature Aluminum Nitride Ceramic Wafer for AutomobileHigh Temperature Aluminum Nitride Ceramic Wafer for AutomobileHigh Temperature Aluminum Nitride Ceramic Wafer for AutomobileHigh Temperature Aluminum Nitride Ceramic Wafer for AutomobileHigh Temperature Aluminum Nitride Ceramic Wafer for AutomobileHigh Temperature Aluminum Nitride Ceramic Wafer for AutomobileHigh Temperature Aluminum Nitride Ceramic Wafer for Automobile
 

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