Innovacera High Precision Aln Aluminum Nitride Heat Sinks Parts Substrate for Semiconductors

• Certification: RoHS, CE
• Type: Industrial Parts
• Material: Aluminum Nitride
• Form: Plate
• Shape: Plate
• Volume Resistivity: ≥10(14)
• Flexural Strength: ≥450MPa
• Color: Grey
• Dielectric Constant: 8-10 1MHz
• Thermal Conductivity: (25°c) 180
• Processing Service: Moulding
• Density: ≥3.33G/Cm3
• Feature: High Thermal Conductivity
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

Aluminum Nitride Ceramic (AlN) is a special ceramic material that combines high thermal conductivity with high electrical resistivity. Only a few ceramics possess high thermal conductivity: Such as Beryllium Oxide (BeO) and cubic Boron Nitride (c-BN) are virtually the only other examples. However, the use of BeO is restricted due to its powder toxicity, and c-BN is very difficult to produce.

Also, the material is suitable for further processing with thick and thin-film technology aluminum nitride is an ideal material for applications in telecommunications technology.

Aluminum nitride ceramic is therefore used as a substrate for semiconductors, as well as for high-power electronic parts, housings, and heat sinks.

 

Application:
-Heat sinks & heat spreaders
-Chucks, clamp rings for semiconductor processing equipment
-Electrical insulators
-Silicon wafer handling and processing
-Substrates & insulators for microelectronic devices & opto electronic devices
-Substrates for electronic packages
-Chip carriers for sensors and detectors
-Laser heat management components
 

 

 

Aluminium Nitride Material Properties
Material		ALN
Item No.		INC-AN180	INC-AN200	INC-AN220
Color		Gray	Gray	Beige
Main Content		96%ALN	96%ALN	97%ALN
Main Characteristics		High Thermal Conductivity,Excellent Plasma Resistance
Main Applications		Heat Dissipating Parts,Plasma Resistance Parts
Bulk Density		3.30	3.30	3.28
Water Absorption		0	0	0
Vickers Hardness(Load 500g)		10.0	9.5	9.
Flexural Strength		>=350	>=325	>=280
Compressive Strength		2500	2500	-
Young' Modulus of Elasticity		320	320	320
Poisson's Ratio		0.24	0.24	0.24
Fracture Toughness		-	-	-
Coefficient Linear Thermal Expansion	40-400degree	4.8	4.6	4.5
Thermal Conductivity	20degree	180	200	220
Specific Heat		0.74	0.74	0.76
Thermal Shocking Resistance		-	-	-
Volume Resistivity	20degree	>=10-14	>=10-14	>=10-13
Dielectric Strength		>=15	>=15	>=15
Dielectric Constant	1MHz	9	8.8	8.6
Loss Tangent	*10-4	5	5	6