Dbc Au Coating Aluminium Nitride Aln Ceramic Substrate / Sheet

• Application: Aerospace, Electronics, Medical, Refractory
• Conductive Layer: Thick Copper Layer
• Material: Al2O3
• Model NO.: AA INC-DBC20310
• Process: Direct Bonded Copper
• Thickness: Customized
• Vickers Hardness: 11
• Dielectric Loss: 9
• Shape: Plate
• Max Use Temperature: 1400°c
• Color: White
• Hardness: 11.5
• Thermal Conductivity: 24.7
• Processing Service: Moulding, Active Metal Bonding
• Density: 3.6-3.7
• Flexural Strength: 300MPa
• Material Composition: Alumina, Al2O3
• Speciality: High Insulation, High Strength
• Type: Ceramic Plates
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 200000 Piece/Pieces Per Month

Product Description

DBC substrate short for Direct Bonded Copper substrate is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications. 

1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation

Applied Area
 

* Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control  * Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors 

 * Home Appliance: Air Conditioner, Peltier Cooler 

 * Industrial: LED Displays, Welding Machine

 * Aerospace: Laser, Power Supply for Satellites and Aircrafts 

 * Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power
 
 * PC/IT: Power Supply, UPS System

Ceramic Materials Properties
1. High Thermal Conductivity 
2. Low Thermal Expansion 
3. High Strength 
4. High Wettability for Solder

DBC Design Guide
Item	Unit	Value
Master Card Size	mm	138x190 ±1.5%
		USABLE AERA 127×178
Dimension Tolerance	mm	-4
Copper Edge to Ceramic Edge	mm	±0.15
Pattern Mismatch	mm	≤0.2
Etch Factor	-	>2
Chip	t	L : max.1, W&D : 0.5
Total Thickness	%	±7
Surface Roughness	μm	Rmax=50 ; Ra≤3 ; Rz≤16
Plating Thickness	μm	Au: 0.01~0.1; Ni: 2~8

Available Material Thickness and Combination
96% Al2O3	Copper Thickness
Thickness	0.127	0.2	0.25	0.3	0.4	0.5
0.25	√	√	√	-	-	-
0.32	√	√	√	√	-	-
0.38	√	√	√	√	-	-
0.5	√	√	√	√	√	√
0.635	√	√	√	√	√	√
1	√	√	√	√	√	√

ZTA	Copper Thickness
Thickness	0.127	0.2	0.25	0.3	0.4	0.5
0.25	√	√	√	√	-	-
0.32	√	√	√	√	√	√

AlN	Copper Thickness
Thickness	0.127	0.2	0.25	0.3	0.4	0.5
0.38	√	√	√	√	-	-
0.5	√	√	√	√	√	√
0.63	√	√	√	√	√	√
1	√	√	√	√	√	√

Material Specification & Properties
Item	Al2O3	ZTA	ALN	Unit
Content	96% Al2O3	90%Al2O3	-	%
		9%ZrO2
Density	3.75	3.95	3.3	g/m³
Thermal Conductivity	>24	>27	>170	W/m.K
Electrical Resistivity	>1014	>1014	>1014	Ω·cm
Dielectric Constant	9.8	10.5	9	1Mhz
Dielectric Strength	>20	>20	>20	KV/mm
Dielectric Loss	0.0003	0.0003	0.0005	1Mhz
Bending Strength	>350	>600	>350	MPa
(Σ0,M>10)
Young’s Modulus	340	310	320	Gpa
Coefficient of Thermal Expansion	6.8	7.5(40℃~400℃)	4.7	x10-6/K
	20℃~300℃)	8.4(40℃~800℃)	(20℃~300℃)