Application: | Aerospace, Electronics, Medical, Refractory |
---|---|
Conductive Layer: | Thick Copper Layer |
Material: | Al2O3 |
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DBC Design Guide | ||
Item | Unit | Value |
Master Card Size | mm | 138x190 ±1.5% |
USABLE AERA 127×178 | ||
Dimension Tolerance | mm | -4 |
Copper Edge to Ceramic Edge | mm | ±0.15 |
Pattern Mismatch | mm | ≤0.2 |
Etch Factor | - | >2 |
Chip | t | L : max.1, W&D : 0.5 |
Total Thickness | % | ±7 |
Surface Roughness | μm | Rmax=50 ; Ra≤3 ; Rz≤16 |
Plating Thickness | μm | Au: 0.01~0.1; Ni: 2~8 |
Available Material Thickness and Combination | ||||||
96% Al2O3 | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.25 | √ | √ | √ | - | - | - |
0.32 | √ | √ | √ | √ | - | - |
0.38 | √ | √ | √ | √ | - | - |
0.5 | √ | √ | √ | √ | √ | √ |
0.635 | √ | √ | √ | √ | √ | √ |
1 | √ | √ | √ | √ | √ | √ |
ZTA | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.25 | √ | √ | √ | √ | - | - |
0.32 | √ | √ | √ | √ | √ | √ |
AlN | Copper Thickness | |||||
Thickness | 0.127 | 0.2 | 0.25 | 0.3 | 0.4 | 0.5 |
0.38 | √ | √ | √ | √ | - | - |
0.5 | √ | √ | √ | √ | √ | √ |
0.63 | √ | √ | √ | √ | √ | √ |
1 | √ | √ | √ | √ | √ | √ |
Material Specification & Properties | ||||
Item | Al2O3 | ZTA | ALN | Unit |
Content | 96% Al2O3 | 90%Al2O3 | - | % |
9%ZrO2 | ||||
Density | 3.75 | 3.95 | 3.3 | g/m³ |
Thermal Conductivity | >24 | >27 | >170 | W/m.K |
Electrical Resistivity | >1014 | >1014 | >1014 | Ω·cm |
Dielectric Constant | 9.8 | 10.5 | 9 | 1Mhz |
Dielectric Strength | >20 | >20 | >20 | KV/mm |
Dielectric Loss | 0.0003 | 0.0003 | 0.0005 | 1Mhz |
Bending Strength | >350 | >600 | >350 | MPa |
(Σ0,M>10) | ||||
Young’s Modulus | 340 | 310 | 320 | Gpa |
Coefficient of Thermal Expansion | 6.8 | 7.5(40℃~400℃) | 4.7 | x10-6/K |
20℃~300℃) | 8.4(40℃~800℃) | (20℃~300℃) |