Innovacera Dbc Metallized Ceramic Substrate with Copper Pads Gold Finish

• Application: Aerospace, Electronics, Medical, Refractory, Industrial Ceramic
• Dielectric Loss: 0.0005
• Dielectric Constant: 9
• Model NO.: DBC Substrate
• Max Use Temperature: 300°c
• Electrical Resistivity: >10^14
• Dielectric Strenght: >20
• Bending Strength: >350
• Thermal Conductivity: >170
• Processing Service: Moulding, Active Metal Bonding
• Material Composition: Alumina, Al2O3
• Speciality: High Insulation, High Strength
• Type: Ceramic Plates
• Transport Package: Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

DBC substrate short for Direct Bonded Copper substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications.

1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation

 

 

Applied Area

* Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control

* Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power Transistors

* Home Appliance: Air Conditioner, Peltier

Cooler

* Industrial: LED Displays, Welding Machine

* Aerospace: Laser, Power Supply for Satellites and Aircrafts

* Environmental Technology: Local Power
Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power

* PC/IT: Power Supply, UPS System

 

Ceramic Materials Properties

1. High Thermal Conductivity
2. Low Thermal Expansion
3. High Strength
4. High Wettability for Solder

Patterning Process

Material Specification & Properties
Item	Al2O3	ZTA	ALN	Unit
Content	96% Al2O3	90%AlO	-	%
						9%ZrO2
Density	3.75	3.95	3.3	g/m³
Thermal Conductivity	>24	>27	>170	W/m.K
Electrical Resistivity	>1014	>1014	>1014	Ω·cm
Dielectric Constant	9.8	10.5	9	1Mhz
Dielectric Strength	20	20	20	KV/mm
Dielectric Loss	0.0003	0.0003	0.0005	1Mhz
Bending Strength	>350	>600	>350	MPa
(Σ0,M>10)
Young's Modulus	340	310	320	Gpa
Coefficient of Thermal Expansion	6.8	7.540~400	4.7	x10-6/K
		20~300	8.440~800		(20~300)

DBC Design Guide
Item	Unit	Value
Master Card Size	mm	138x190 ±1.5%
				USABLE AERA 127×178
Dimension Tolerance	mm	-4
Copper Edge to Ceramic Edge	mm	±0.15
Pattern Mismatch	mm	≤0.2
Etch Factor	-	2
Chip	t	L : max.1, W&D : 0.5
Total Thickness	%	±7
Surface Roughness	μm	Rmax=50 ; Ra≤3 ; Rz≤16
Plating Thickness	μm	Au: 0.01~0.1Ni: 2~8

Available Material Thickness and Combination

96% Al2O3

Copper Thickness

Thickness

0.127

0.2

0.25

0.3

0.4

0.5

0.25

√

√

√

0.32

√

√

√

√

0.38

√

√

√

√

0.5

√

√

√

√

√

√

0.635

√

√

√

√

√

√

1

√

√

√

√

√

√

ZTA	Copper Thickness
Thickness	0.127	0.2	0.25	0.3	0.4	0.5
0.25	√	√	√	√	-	-
0.32	√	√	√	√	√	√

AlN	Copper Thickness
Thickness	0.127	0.2	0.25	0.3	0.4	0.5
0.38	√	√	√	√	-	-
0.5	√	√	√	√	√	√
0.63	√	√	√	√	√	√
1	√	√	√	√	√	√

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