Mo-Mn Metallized Ceramic Insulators for Semiconductor Packaging

• Application: Aerospace, Electronics, Medical, Refractory, Packaging
• Volume Density: 3.6 g/cm3
• Withstand Voltage: 8.3 K VAC/mm
• Flexural Strength: 340 MPa
• Purity: 96%
• Water Absorption: 0
• Compressive Strength: 2103 MPa
• Processing Service: Moulding
• Tensile Strength: 193 MPa
• Material Composition: Alumina, Al2O3
• Type: Ceramic Parts
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

 

METALLIZED CERAMIC INSULATORS Metallization Spec.: Molybdenum/Manganese (Mo/Mn) metallization: 9-30um Ni plating thickness: 3-10um

 

Features 1. The ceramic material is with even texture, each batch has stabilitv quality and flexural strength. 2. Metal laver is dense, constant, smooth and good weldability. 3. Excellent electrical insulation, low dielectric constant good abrasionand corrosion resistance. 4. High tensile strength, good airtightness to meet the requirement of the high-frequency, high-power and safe electrical components.

Application:

Semiconductor packaging, TO packaging, Fiber optic device shell, Laser Shell, Vacuum electronic devices LED
accessories etcs.
 

Material Properties
No	Item	Unit	Value
1	Purity	%	≥95
2	Volume density	g/cm3	≥3.6
3	Water absorption	%	0
4	Thermal conductivity	W/m·K( 25)	22.4
5	Coefficient of thermal expansion	X(10-6)/ (20-1000)	8.2
6	Flexural strength	Mpa	340
7	Compressive strength	Mpa	2103
8	Tensile strength	Mpa	193
9	Hardness	ROCKWELL 45N	78
10	Withstand voltage	K Vac/mm	8.3
11	Dielectric constant	@1MHz	9.1
12	Dielectric loss angle	@1MHz	0.0004
13	Volume resistivity	@25	1x10-14
				@500	4x10-9
				@1000	5x105

 

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