Factory Customized Aln Aluminum Nitride Ceramic Ball

• Application: Aerospace, Electronics, Medical, Refractory, Industrial Ceramic
• Type: Ceramic Balls
• Mechanical Strength: 450MPa
• Size: Customized
• Color: Gray
• Surface Roughness: 0.3-0.5
• Model NO.: Aluminum Nitride Ceramic Ball
• Thermal Conductivity: More Than 170W/Mk
• Processing Service: Welding, Cutting, Moulding
• Transport Package: Sandard Cartons with Foam
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 1000 Piece/Pieces Per Month

Product Description

Aluminum Nitride Ceramic Ball

The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low

dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic,

high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is

widely used in communication components, high power led, power electronic devices and other

fields.Special spec products can be produced upon requests.

 

PRODUCT PERFORMANCE

- High thermal conductivity, high flexural strength, high temperature

- Good electrical insulation

- Low dielectric constant and loss

- Able to be laser drilled, metallized, plated and brazed

 

 

Product Features

 

1.Uniform microstructure

2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives

3.High electrical resistivity

4.Thermal expansion coefficient close to that of Silicon

5.Resistance to corrosion and erosion

6.Excellent thermal shock resistance

7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation

 

occurs around 780°C; the surface layer protects the bulk up to 1380°C).

 

Aluminium Nitride Material Properties
Material			ALN
Item No.			INC-AN180	INC-AN200	INC-AN220
Color			Gray	Gray	Beige
Main Content			96%ALN	96%ALN	97%ALN
Main Characteristics			High Thermal Conductivity,Excellent Plasma Resistance
Main Applications			Heat Dissipating Parts,Plasma Resistance Parts
Bulk Density			3.30	3.30	3.28
Water Absorption			0	0	0
Vickers Hardness(Load 500g)			10.0	9.5	9.
Flexural Strength			>=350	>=325	>=280
Compressive Strength			2500	2500	-
Young' Modulus of Elasticity			320	320	320
Poisson's Ratio			0.24	0.24	0.24
Fracture Toughness			-	-	-
Coefficient Linear Thermal Expansion	40-400degree	4.8	4.6	4.5
Thermal Conductivity	20degree	180	200	220
Specific Heat			0.74	0.74	0.76
Thermal Shocking Resistance			-	-	-
Volume Resistivity	20degree	>=10-14	>=10-14	>=10-13
Dielectric Strength			>=15	>=15	>=15
Dielectric Constant	1MHz	9	8.8	8.6
Loss Tangent	*10-4	5	5	6

 

Application

 

 

 

 

 

- RF / Microwave Components

- Power Modulus

- Power Transformers

- High Power LED Package

 

 

 

 

- Laser Diode Sub-mounts

- LED Chip Sub-mount

- Microelectronic Packages

- Transistors

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