Aluminum Nitride Aln Ceramic Amb Thick Film Substrate with Copper

• Application: Aerospace, Electronics, Medical, Amb Substrate
• Compressive Strength: 2300MPa
• Coating Thickness: 8-30μm
• Model NO.: AA INC-AMB Thick Film Substrate
• Coating Layer: Copper
• Plated Layer: Nickel/Copper/Gold
• Thermal Conductivity: 25W/(M.K)
• Plating Thickness: 2-9μm
• Max. Use Temperature: 1600ºC
• Density: 3.7g/cm3
• Material Composition: Alumina, Al2O3
• Speciality: High Insulation
• Type: Insulating Ceramics
• Transport Package: Standard Cartons with Foam
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 10000 Piece/Pieces Per Month

Product Description

 

Active Metal Brazing Substrates is a technology by applying active metal alloy (Ag, Cu, Ti etc.) to the ceramic surface, the active elements such as Ti and Zr can react with ceramics to form a reaction layer that can be wetted by liquid solder, this allows metal to be joined to ceramic without metallization. This ceramic-to-metal joining owns a higher bonding strength and good reliability, in addition to its excellent mechanical property and good thermal conductivity, which are commonly used in high-power electronic applications such as IGBT and SIC module package.

 

 

Advantages:

1.High thermal conductivity

2.Excellent chemical stability

3.High heat dissipation

4.Copper thickness: ~0.8mm
5.Surface treatment: Ni/NiAu/Ag

Ceramic Materials Properties
Item	Unit	Si3N4	AlN
Density	g/cm3	≥3.2	≥3.3
Thermal Conductivity	W/m·K	≥80	>170
Coefficient of Thermal Expansion	10-6/K	2.5 (20~300)	4.6 (20~300)
Flexural Strength	MPa	>700	>350
Dielectric Loss	x10-4 [1MHz]	10	3.8
Dielectric Constant	1MHz	8~9	9
Dielectric Strength	Kv/mm	-	17
Volume Resistivity	Ω·cm	>1014	>1014
Young's Modulus of Elasticity	GPa	300~310	320

Thickness
Thickness	Si3N4 Ceramic	Copper
0.25	√
0.3		√
0.32	√
0.5	√	√
0.8	√	√
1	√

Surface Finish
Plating Process	Thickness
Electroless Ni	2~8um (6%~10% P)
Electroless NiAu	Au: 0.01~0.1um; Ni: 2~8um
Electroless Ag	Ag: 0.1~0.6um

Tolerance
Item	Tolerance (mm)
Ceramic	WxD: ±1% (min.0.1mm) T: ±10%
Copper	Copperthickness: >0.3~0.5	±0.015
		Copperthickness: >0.8~1.2	±0.035

Surface Roughness and Warpage
Item	Roughness	Warpage
Ceramic	0.2~0.8	≤0.25%
Copper	≤0.8	≤0.05%/25

 

VR

 

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