• Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
  • Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
  • Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
  • Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
  • Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
  • Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging

Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging

Application: Aerospace, Electronics, Medical, Industrial Ceramic
Purity: 95%
Type: Ceramic Plates
Flexural Strength: 300MPa
Shape: Plate
Max Use Temperature: 1600°c
Manufacturer/Factory & Trading Company

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Fujian, China
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Overview

Basic Info.

Color
White
Processing Service
Welding, Cutting, Moulding
Transport Package
Carton Packing
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China

Product Description

Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
 

To keep pace with rapidly changing technology, customers need durable and reliable packaging materials. Innovacera produces a broad range of high performance lids to meet your microelectronic packaging requirements.
Innovacera is the world's leading supplier of hermetic lids for the semiconductor, MEMS, or optical market.

Our metallization capability creates an effective seal ring that allows excellent soldering
Gold-Tin alloys provide superior hermetic sealing
Edge melting provides fillet formation
Other non-precious and lead-free soldering available
Offer tack welding service for soldering performs onto ceramic lids

 
Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
Alumina Ceramic Property
 
 
 
 
 
Property
 
Unit
92% Alumina Ceramic
95% Alumina Ceramic
99% Alumina Ceramic
Density
 
g/cm3
≥3.63
≥3.68
≥3.83
Water absorption
 
%
O
O
O
Sintering temperature
 
°C
1500-1700
1600-1800
1700-1800
Hardness
 
HV
≥1400
≥1500
≥1650
Flexural strength
 
Kgf/cm2
3000
3000
3000
Compressive strength
 
Kgf/cm2
24000
25000
26000
Fracture toughness
 
Map.m3/2
3~4
3~4
4~5
Maximum temperature
 
°C
1600
1700
1800
Coefficient of thermal expansion
 
/°C
8*10-6
8*10-6
8*10-6
Heat shock
 
T(°C)
220
220
220
Thermal conductivity
 
W/m.k(25-300°C)
25 14
25 14
25 14
 
20°C
 
>1012
>1012
>1012
Recommend Products
Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
Product Classification
Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
Company Profile
Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
Why Choose Us
Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
Product packaging
Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
Browse More Products
Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging
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