Innovacera Mechanical Seal Cover Al2O3 Ceramic Lid for Integrated Circuit Packaging

• Application: Aerospace, Electronics, Medical, Industrial Ceramic
• Flexural Strength: 300MPa
• Shape: Plate
• Max Use Temperature: 1600°c
• Color: White
• Processing Service: Welding, Cutting, Moulding
• Purity: 95%
• Type: Ceramic Plates
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

 

To keep pace with rapidly changing technology, customers need durable and reliable packaging materials. Innovacera produces a broad range of high performance lids to meet your microelectronic packaging requirements.
Innovacera is the world's leading supplier of hermetic lids for the semiconductor, MEMS, or optical market.

Our metallization capability creates an effective seal ring that allows excellent soldering
Gold-Tin alloys provide superior hermetic sealing
Edge melting provides fillet formation
Other non-precious and lead-free soldering available
Offer tack welding service for soldering performs onto ceramic lids
 

Alumina Ceramic Property
Property			Unit	92% Alumina Ceramic	95% Alumina Ceramic	99% Alumina Ceramic
Density			g/cm3	≥3.63	≥3.68	≥3.83
Water absorption			%	O	O	O
Sintering temperature			°C	1500-1700	1600-1800	1700-1800
Hardness			HV	≥1400	≥1500	≥1650
Flexural strength			Kgf/cm2	3000	3000	3000
Compressive strength			Kgf/cm2	24000	25000	26000
Fracture toughness			Map.m3/2	3~4	3~4	4~5
Maximum temperature			°C	1600	1700	1800
Coefficient of thermal expansion			/°C	8*10-6	8*10-6	8*10-6
Heat shock			T(°C)	220	220	220
Thermal conductivity			W/m.k(25-300°C)	25 14	25 14	25 14
	20°C		>1012	>1012	>1012

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