Innovacera Black High Purity Aln Aluminum Nitride Ceramic Plate

• Application: Aerospace, Electronics, Medical, Refractory
• Type: Ceramic Parts
• Maximum Use Temperature: 800°c
• Thermal Conductivity (20 °c): 80 - 100 W/M K
• Dielectric Strength (6.35mm): 16.0 - 19.7 AC-Kv/mm
• Volume Resistivity (25°c): 1013 to 1014 ( Ω-Cm )
• Fracture Toughness, Kic: 2.75 - 6.0 MPa M1/2
• Flexural Strength, Mor (20 °c): 300 - 460 MPa
• Coefficient of Thermal Expansion: 3.3 - 5.5 1 X 10-6/°c
• Processing Service: Moulding
• Dielectric Loss (Tan): 1 X 10-4 to 5 X 10-4
• Transport Package: Carton Packing
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China

Product Description

 

Products Description

Hot pressed aluminum nitride (AlN) is used in applications requiring high electrical resistivity in additional to exceptional thermal conductivity. The applications for hot pressed AlN typically involve rigorous or abrasive environments and high-temperature thermal cycling.

Hot Pressed Alumina Nitride Properties:

Property	Units	Value
Flexural Strength, MOR (20 °C)	MPa	300-460
Fracture Toughness	MPa m1/2	2.75-6.0
Thermal Conductivity (20 °C)	W/m K	80-140
Coefficient of Thermal Expansion	1 x 10-6/°C	3.3-5.5
Maximum Use Temperature	°C	800
Dielectric Strength (6.35mm)	ac-kV/mm	16.0-19.7
Dielectric Loss	1MHz, 25 °C	1 x 10-4 to 5 x 10-4
Volume Resistivity (25°C)	Ω-cm	1013 to 1014

 

Features
>High thermal conductivity
>Expansion coefficient can match with semiconductor silicon chips
>High insulation resistance and voltage withstand strength
>Low dielectric constant and low dielectric loss
>High mechanical strength

Maximum Size of Hot Press Sintering

Length500 x width500 x height< 350 mm

Outer diameter 500 x height < 500 mm

We can provide Hot Pressed Aluminum Nitride (HPAN) as required.

 

 

Packing and Storage
Standard Packing: Sealed bags in carton boxes. Special package is available on request.