Innovacera High Quality Aluminum Nitride Aln Ceramic Plate Wafer

• Application: Structure Ceramic, Industrial Ceramic
• Type: Ceramic Plate, Ceramic Plates
• Size: Customized Size
• Chemical Durability: 0.97
• Thermal Shock Resistance: 382.7
• Thermal Conductivity: >170
• Model NO.: NN-175655
• Density: 3.335
• Certification: ISO9001:2015/RoHS
• Material: Aln
• Transport Package: Standard Safety Cartons with Plastic Foams
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 2000 Piece/Pieces Per Month

Product Description

High Quality Aluminum Nitride ALN Ceramic Plate Wafer The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests.

PRODUCT PERFORMANCE

1.Uniform microstructure

2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives

3.High electrical resistivity

4.Thermal expansion coefficient close to that of Silicon

5.Resistance to corrosion and erosion

6.Excellent thermal shock resistance

7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation

occurs around 780°C; the surface layer protects the bulk up to 1380°C).

Regular Dimensions of AlN Substrate/Wafer
Thickness(mm)	Length*Width(mm)
0.385	2″* 2"		3″* 3″		4″* 4″		4.5″* 4.5″
0.5	50.8*50.8 mm		76.2*76.2mm		101.6*101.6mm		114.3*114.3mm
0.635
1.0
Diameter(mm)
1.0	Φ16	Φ20	Φ30	Φ40	Φ50	Φ60	Φ75	Φ80
	Φ19	Φ26	Φ35	Φ45	Φ52
PS: Other dimensions which are not listed are available upon your requests.

 

 

 

 

 

Material Properties of Aluminum Nitride Substrate/Wafer
Property Content	Property Index
Density(g/cm³)	3.335
Resistance to Thermal Shock	No Cracks
Thermal conductivity(30, W/m.k)	≥170
Linear expansion coefficient (/, 5/min, 20-300)	2.805×10­6
Flexural strength (MPa)	382.7
Volume Resistivity (Ω.cm)	1.4×1014
Dielectric constant(1MHz)	8.56
Chemical Durability (mg/cm²)	0.97
Dielectric strength (KV/mm)	18.45
Surface roughness Ra(μm)	0.3~0.5
Camber (length‰)	≤2‰
Appearance/ Color	Dense/ Dark Gray

 

Application

 

 

- RF / Microwave Components

- Power Modulus

- Power Transformers

- High Power LED Package
 

 

- Laser Diode Sub-mounts

- LED Chip Sub-mount

- Microelectronic Packages

- Transistors
 

- High Thermal Conductivity Substrates for LED & Power Electronics

- Substrates for Power Electronics

 

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