Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni

Product Details
Application: Aerospace, Electronics, Medical, Refractory, Industrial Ceramic
Flexural Strength: 300MPa
Shape: Plate
Manufacturer/Factory & Trading Company

360° Virtual Tour

Diamond Member Since 2024

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Self-branded
The supplier has 2 Self-brands, check the Audit Report for more information
QA/QC Inspectors
The supplier has 3 QA and QC inspection staff
R&D Capabilities
The supplier has 2 R&D engineers, you can check the Audit Report for more information
Product Certification
The supplier's products already have relevant certification qualifications, including:
CE
to see all verified strength labels (26)
  • Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
  • Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
  • Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
  • Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
  • Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
  • Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
Find Similar Products

Basic Info.

Model NO.
Metallized Ceramics Substrate
Color
White
Aln Thermal Conductivity
≥170
Hardness
11.5
Processing Service
Welding, Cutting, Moulding, Ni Plating, Au Plating
Material Composition
Alumina, Al2O3
Speciality
High Insulation, High Strength
Type
Ceramic Plates
Transport Package
Vaccum&Carton Packaging
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China
Production Capacity
100000 Piece/Pieces Per Month

Product Description

Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni

 

 
DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century.
 
DBC Substrate Features:
1.High mechanical strength,mechanically stable shape;high strength,fine thermal conductivity,excellent electrical
isolation;good adhesion,corrosion resistant;
2.Much better thermal cycling capabilities (up to 50000 cycles),high reliability;
3.May be structured just like PCB boards or IMS substrates to get etched wiring;
4.No contamination,environmentally clean;
5.Wide application temperature:-55 ~ 850; The thermal expansion coefficient is closed to that of silicon, so production technologies of power module are greatly simplified. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer's drawings or samples
Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni

 

Properties
Properties
 
Unit
Test Method
Material
 
 
 
 
 
 
IN94
IN96
IN99
Mechanical
Color
-
-
White
White
Ivory
 
Alumina Content
%
-
94
96
99
 
Bulk Density
g/cm3
ASTM C-20-83
3.70
3.80
3.90
 
Surface Roughness
Um
Profilometer
-
Max 0.6
-
 
Water Absorption
%
ASTM C373-72
0.0
0.0
0.0
 
Average Crystalline Size
Um
ASTM E112-88
4
3
4
 
Flexural Strength (20°C)
MPa
ASTM F417-78
350
370
370
 
Elastic Modulus
Gpa
ASTM C773-82
290
310
340
 
Poisson's Ratio
-
ASTM C773-82
0.22
0.22
0.22
 
Compressive Strength
Mpa
ASTM C773-82
2100
-
2500
 
Hardness
-
Knoop 1KG
12
-
14
 
Fracture Toughness
Mpa.m1/2
NOCHED BEAM
3.4
-
4.5
Thermal
Thermal Conductivity (20°C)
W/m.K
ASTM C408-82
21
24
28
 
Coefficient of Thermal Expansion(20~1000°C)
×10-6/°C
ASTM C372-81
8.0
7.8
8.1
 
Specific Heat
Cal/g°C
ASTM C351-82
0.2
0.2
0.2
 
Thermal Shock Resistance
°C
Customer
200
200
200
 
Max. Use Temperature
°C
-
1600
1600
1650
Electrical
Dielectric Strength
KV/mm
ASTM D116-76
≥12
≥15
≥17
 
Dielectric Constance (1MHz.25°C)
-
ASTM D150-81
9.2
9.6
9.7
 
Dielectric Loss (tan delta, 1MHz.25°C)
-
ASTM D150-81
0.0004
0.0003
0.0002
 
Volume Resistivity (25°C)
Ωcm2/cm
ASTM D1829-68
≥10 14
≥10 14
≥10 14
Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
Alumina 96% Ceramic Dbc One Side Substrate with Nickel Ni
SEND ME
If you are interested in our products, please click here to send me an inquiry, and I will reply you within 8 hours

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier