Aluminum Nitride Ceramic Structural Parts to Use as Thermal Materials

• Application: Aerospace, Electronics, Medical
• Density: 3.31g/cm3
• Material: Aluminum Nitride
• Shape: Customized
• Transport Package: Standard Safety Cartons with Plastic Foams
• Specification: Customized
• Trademark: INNOVACERA
• Origin: Fujian, China
• Production Capacity: 200000 Piece/Pieces Per Month

Product Description

Aluminum nitride (AIN) is known for its high thermal conductivity and excellent electrical insulation properties. It is a common

ceramic material used in a variety of electrical devices. In addition to its coefficient of thermal expansion and electrical insulation

capabilities, aluminum nitride ceramics are resistant to most molten metals, such as copper, lithium and aluminum.

 

Properties of aluminum nitride ceramics
Aluminum nitride has a variety of properties that make it suitable for a variety of industrial applications:
High thermal conductivity (above 170 W/mK). This is close to the value of BeO and SiC and more than five times that of aluminum oxide (Al2O3).
Its coefficient of thermal expansion is 4.5 *10-6°C, the same as that of silicon (3.5-4 *10-6°C).
It has good light transmission properties
It is not toxic.
Good electrical conductivity. Aluminum nitride's electrical properties include its dielectric constant, dielectric loss, bulk resistivity and dielectric strength - all of which make it an excellent insulating material.
Good mechanical properties: Aluminum's mechanical properties are also responsible for its widespread use in industrial processes. It has a higher flexural strength than aluminum oxide (Al2O3) and beryllium oxide (BeO) ceramics.

Wide range of aluminum nitride ceramics
Aluminum nitride ceramics are used in many applications because of their good properties, including high thermal conductivity, low dielectric constant and dielectric loss, high dielectric strength, and significant resistance to plasma erosion.
Chip heat dissipation and support
Aluminum nitride ceramic substrates (ceramic trays) in semiconductor devices
Aluminum nitride etch shielding
Aluminum nitride evaporation boats for OLEDs
Also used for packaging of various electronic components
 

Aluminium Nitride Ceramic Properties
Item	Unit		AIN
Color			Light Blue
Density	g/cm		≥3.33
Thermal Conductivity	20ºC,W/(m.K)		≥170
Dielectric Constant	1MHz		8-10
Dielextric Strength	KV/mm		≥17
Flexural Strength	Mpa		≥450
Camber	Length ‰		≤2%
Surface Roughness Ra	μm		0.3-0.6
Water absorption	%		0
Volume Resistivity	Ω·cm 20ºC		≥1014
Thermal expansivity	10-8mm/c	20-300ºC	2-3
		300-800ºC	2.5-3.5
Loss Tangent	(x10-4)		2.0
Poisson's Ratio			0.24