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High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink

High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink pictures & photos
High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink pictures & photos
High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink pictures & photos
High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink pictures & photos
  • High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink
  • High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink
  • High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink
  • High Thermal Conductivity 170m/Mk Aluminum Nitride Ceramic Substrate for Heat Sink
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US $1.00-100.00 / pieces | 1 pieces (Min. Order)
Application: Aerospace, Electronics, Medical
Type: Ceramic Ring
Volume Resistivity: 1.4*10(14) Ω.Cm
Flexural Strength: 450MPa
Color: Light Grey
Dielectric Strength: 18.45 Kv/mm
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