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Electrical Direct Bonded Copper Dbc Ceramic Substrate for High Power Module

Electrical Direct Bonded Copper Dbc Ceramic Substrate for High Power Module pictures & photos

Electrical Direct Bonded Copper Dbc Ceramic Substrate for High Power Module pictures & photos

Electrical Direct Bonded Copper Dbc Ceramic Substrate for High Power Module pictures & photos

Electrical Direct Bonded Copper Dbc Ceramic Substrate for High Power Module pictures & photos

Electrical Direct Bonded Copper Dbc Ceramic Substrate for High Power Module pictures & photos

Electrical Direct Bonded Copper Dbc Ceramic Substrate for High Power Module pictures & photos

Application:	Aerospace, Electronics, Medical, Refractory, Industrial Ceramic
Material Composition:	Alumina, Al2O3
Speciality:	High Insulation
Type:	Ceramic Plates
Dielectric Loss:	0.0003
Shape:	Plate

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