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Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate for for Peltier Module and Semiconductors

Name: Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate for for Peltier Module and Semiconductors
Brand: Xiamen Innovacera Advanced Materials Co., Ltd.
SKU: pAcrZFdxHUWJ
Price: 15.00 USD
Availability: InStock

Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate for for Peltier Module and Semiconductors pictures & photos

Application:	Aerospace, Electronics, Medical, Vacuum Brazing
Material Composition:	Alumina, Al2O3
Speciality:	High Insulation
Type:	Insulating Ceramics
Compressive Strength:	2300MPa
Coating Thickness:	8-30μm

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