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Hot Pressing Aluminum Nitride Used for Semiconductor Fabrication Equipments

Hot Pressing Aluminum Nitride Used for Semiconductor Fabrication Equipments pictures & photos

Hot Pressing Aluminum Nitride Used for Semiconductor Fabrication Equipments pictures & photos

Hot Pressing Aluminum Nitride Used for Semiconductor Fabrication Equipments pictures & photos

Hot Pressing Aluminum Nitride Used for Semiconductor Fabrication Equipments pictures & photos

Application:	Aerospace, Electronics, Medical, Refractory, IGBT, Powe Modules, Electronics
Type:	Ceramic Parts
Flexural Strength:	450MPa
Surface Roughness:	0.3-0.6
Color:	Light Grey
Dielectric Constant:	8-10

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