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Electrical Direct Bond Copper Alumina Metallized Dbc Aln Ceramic Substrate with Copper

Electrical Direct Bond Copper Alumina Metallized Dbc Aln Ceramic Substrate with Copper pictures & photos

Electrical Direct Bond Copper Alumina Metallized Dbc Aln Ceramic Substrate with Copper pictures & photos

Electrical Direct Bond Copper Alumina Metallized Dbc Aln Ceramic Substrate with Copper pictures & photos

Electrical Direct Bond Copper Alumina Metallized Dbc Aln Ceramic Substrate with Copper pictures & photos

Electrical Direct Bond Copper Alumina Metallized Dbc Aln Ceramic Substrate with Copper pictures & photos

Electrical Direct Bond Copper Alumina Metallized Dbc Aln Ceramic Substrate with Copper pictures & photos

Application:	Aerospace, Electronics, Medical, Refractory, Vacuum Brazing
Compressive Strength:	2300MPa
Coating Thickness:	8-30μm
Coating Layer:	Mo/Mn
Plated Layer:	Nickel/Copper/Gold
Thermal Conductivity:	25W/(M.K)

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